Design for Excellence:

DFM (Design for Manufacturing)

DFR (Design for Reliability)

DFA (Design for Assembly)

Instructor: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation

Traditional design for excellence programs focused on matching the design to manufacturing, assembly, test and reliability requirements. However, with the high diversity of component packages, decreased spacing between components, increased complexity of printed boards, increased diversity of materials and reliability requirements, it is not feasible to achieve a high-yielding, reliable, manufacturing process.

This course will discuss the impacts of z-axis defects and introduce the concept of design-for-matched-process (DFMP) and provide examples of several opportunities within z-axis control and DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching, environmental controls and test fixture development and will review elements and opportunities of conducting a design for excellence program including; defining how success is measured, supplier documentation accuracy, globalization issues, understanding of PCB fabrication technologies and process, and limitation of industry standards (fabrication, design, assembly).

What you will learn:

Understanding of errors component supplier documentation
PCB laminate material types and impacts on function and reliability
Copper thickness impacts on fabrication process
Via formation and hole filling options
Solder mask and silk screen impacts to assembly and reliability
PCB design complexity impacts on fabrication costs and reliability
Limitation of industry standards
SMT assembly design impacts
Through hole component (Wave/Selective) solder design impacts
PCB design impacts to assembly: thermal balance, trace routing, via interconnection, Z-axis TCE
Impacts of component and PCB warpage/flatness on yields and reliability
Process tooling (assembly/test) impacts
Impacts of design on process control issues; paste volume, SMT and PTH thermal shock, reflow warpage
Design for cleaning issues
Limitation of industry standards

Who should attend:
Designers, Manufacturing/Process Engineers, Quality and Reliability Engineers, and Managers or Technicians that are involved with the design, fabrication, assembly or testing of printed board assemblies.

IPC Technical Education PRESENTS - Nov 12

2019 Exhibitor List

3G Shielding



​Alan Lupton Associates


American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers


Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group


​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA


​EMA Design Automation

​ERNI Electronics


Firan Technology Group (FTG)

GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices

​ICAPE Group


Imagineering Inc

​Imperative Product Operations

​Indium Corporation


Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

METZ Connect USA


Oak Mitsui Technologies

Oasis Scientific


​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions


Porticos Asia Limited

Printed Circuit Design & Fab


Prototron Circuits



​Rep Inc


Rogers Corporation



Sunshine Global Circuits


​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc


​TTM - Advantage Board Reps



​Wallace Electronic Sales

​WDL Systems

​Wireless Research Center


Tentative Course Schedule:

8:00am - 9:00am:  Check-In and Breakfast opens

9:00am - 12:00pm:  Morning Class

12:00pm - 1:00pm:  Luncheon

1:00pm - 5:00pm:  Afternoon Class

5:00pm:  Adjourn 

This course is being held the day before PCB Carolina so you can attend both!

About the Instructor
Dale Lee
Senior Staff DFX Strategy Engineer, Plexus Corporation

Dale Lee is a senior staff DFX strategy engineer with Plexus Corporation, primarily involved with DFX analysis and definition/correlation of design, process, and tooling impacts on printed board fabrication/assembly processes, manufacturing yields and reliability. He has served as an author, instructor and speaker on advanced packaging, PCB and SMT design, assembly DFX and rework.


(919) 342-0810

​McKimmon Center

1101 Gorman Street

Raleigh, NC 27606