​McKimmon Center

1101 Gorman Street

Raleigh, NC 27606

Check-in
Workshop
Refreshment Break
Networking Luncheon
Refreshment Break
Adjourn

Tuesday, November 12, 2019
8:00 AM - 8:30 AM
8:30 AM
10:15 AM - 10:30 AM
12:00 PM - 1:00 PM
3:00 PM - 3:15 PM
5:00 PM

This course is being held the day before PCB Carolina so you can attend both!

IPC Technical Education PRESENTS - Nov 12


Venue:

Design for Excellence:

DFM (Design for Manufacturing)

DFR (Design for Reliability)

DFA (Design for Assembly)

Instructor: Dale Lee, Senior Staff DFX Strategy Engineer, Plexus Corporation

Traditional design for excellence programs focused on matching the design to manufacturing, assembly, test and reliability requirements. However, with the high diversity of component packages, decreased spacing between components, increased complexity of printed boards, increased diversity of materials and reliability requirements, it is not feasible to achieve a high-yielding, reliable, manufacturing process.

This course will discuss the impacts of z-axis defects and introduce the concept of design-for-matched-process (DFMP) and provide examples of several opportunities within z-axis control and DFMP for yield improvement through manufacturing tooling design, SMT and PTH assembly process matching, environmental controls and test fixture development and will review elements and opportunities of conducting a design for excellence program including; defining how success is measured, supplier documentation accuracy, globalization issues, understanding of PCB fabrication technologies and process, and limitation of industry standards (fabrication, design, assembly).

What you will learn:

Understanding of errors component supplier documentation
PCB laminate material types and impacts on function and reliability
Copper thickness impacts on fabrication process
Via formation and hole filling options
Solder mask and silk screen impacts to assembly and reliability
PCB design complexity impacts on fabrication costs and reliability
Limitation of industry standards
SMT assembly design impacts
Through hole component (Wave/Selective) solder design impacts
PCB design impacts to assembly: thermal balance, trace routing, via interconnection, Z-axis TCE
Impacts of component and PCB warpage/flatness on yields and reliability
Process tooling (assembly/test) impacts
Impacts of design on process control issues; paste volume, SMT and PTH thermal shock, reflow warpage
Design for cleaning issues
Limitation of industry standards

Who should attend:
Designers, Manufacturing/Process Engineers, Quality and Reliability Engineers, and Managers or Technicians that are involved with the design, fabrication, assembly or testing of printed board assemblies.

About the Instructor
Dale Lee
Senior Staff DFX Strategy Engineer, Plexus Corporation

Dale Lee is a senior staff DFX strategy engineer with Plexus Corporation, primarily involved with DFX analysis and definition/correlation of design, process, and tooling impacts on printed board fabrication/assembly processes, manufacturing yields and reliability. He has served as an author, instructor and speaker on advanced packaging, PCB and SMT design, assembly DFX and rework.
 

2020 Exhibitor List

  1. ​3G Shielding Specialties
  2. 3DOLOGIE
  3. ACDI
  4. Aerotek
  5. AGC Nelco America, Inc.
  6. American Circuits, Inc.
  7. Amitron Corporation
  8. Assembly Technologies
  9. Aurora Technical Sales
  10. Better Boards
  11. Cadence Design Systems
  12. CertifiGroup
  13. Creation Technologies
  14. DNA Group, Inc
  15. Downstream Technologies
  16. ELANTAS PDG, Inc.
  17. Electronic Interconnect
  18. Electro-Rep Associates
  19. EMA Design Automation
  20. Epec Engineered Tech
  21. ICAPE Group
  22. IES, Inc.
  23. Imagineering Inc.
  24. Indium Corporation
  25. IPC
  26. Keysight Technologies
  27. Leader Tech Inc.
  28. METZ CONNECT USA
  29. Nelson-Miller, Inc.
  30. Oak-Mitsui Technologies
  31. Oasis Scientific
  32. PalPilot
  33. PCB Power Inc
  34. PFC Flexible Circuits Limited
  35. Polar Instruments
  36. Printed Circuit Design & Fab
  37. Pulsonix
  38. RBB Systems
  39. RISHO
  40. Royal Circuit Solutions
  41. Samtec
  42. SEP CO., LTD.
  43. SOMACIS
  44. Specialty Coating Systems
  45. SSI Electronics Inc.
  46. Sunshine Global Circuits
  47. Teledyne LeCroy
  48. TFS Inc.
  49. The Test Connection, Inc.
  50. TriMech
  51. Wallace Electronic Sales
  52. WDL Systems
  53. Wireless Research Center


NOVEMBER 11th

(919) 342-0810