​​​

​3G Shielding Specialties

ACDi

Adiva Corporation

​Aerotek

Alan Lupton Associates

Altium

American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology

Compunetics

​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices

​IMDS DATA

Indium Corporation

IPC

​JBC Tools USA

​JMC Too & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA

Nelson-Miller

​Oasis Scientific

PalPilot

​Panacol-USA

​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions

Porticos

Porticos Asia Limited

​Printed Circuit Design & Fab

​Protolabs

​Pulsonix

​Rep Inc

​Risho

Royal Circuit Solutions

​Samtec

​SEP Co

​Tektronix

​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D

​TriMech

​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing


2018 Exhibitor List

Tel:  (919) 342-0810​

With the pitch of the parts getting tighter and the pin count of BGAs going up, there is a need to get as much routing, on as few layers as possible, into very dense areas of the board. HDI will help to accomplish this, but the technology requires some different setup and thought as to what is needed and how to accomplish it from a design perspective. First, the designer needs to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved. The presentation will go into the different possible stackup types next, and discuss ways to get signals and powers from layer to layer in the board. Then we will move on into possible patterns and grids such as via in pad, offset or swing vias to maximize fanout and routing opportunities, all the while keeping routing return, power distribution, and layer paired routing in mind. Lastly, we will talk about the benefits to other parts on the board that HDI can provide, and some information about the unique manufacturing needs of these types of boards.

HDI PCBs are printed circuit boards that feature higher wiring density per surface area than standard PCBs. As parts become tighter and pin counts of BGAs increase, it is necessary to get as much routing, on as few layers as possible, into very dense areas of PCBs. By using HDI technology, it is possible to place more components on both sides of the raw PCB.  From a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. This course will provide instruction in HDI technology, covering:

  • the structure of the HDI traces and vias
  • options and effects of cost and electronics
  • options for stack up types
  • how to get signals and powers from layer to layer in the board
  • patterns and grids such as via in pad, offset or swing vias to maximize fanout and routing opportunities
  • routing return, power distribution, and layer paired routing


Discussion about the benefits HDI technology provides to other parts on the board, along with the unique manufacturing needs of these types of boards will also be covered.

Instructor

Susy Webb
Sr. PCB Designer for Design Science
 
Susy Webb is a senior PCB designer with 37 years of experience. Her career includes experience in point-to-point microwave network systems, coastal and oceanographic oil exploration and monitoring equipment, and CPCI and ATX computer motherboards. She has set up company standards, documentation, procedures, and library conventions for several companies. Webb is a regular speaker at the PCB, IPC and international Design conferences and consults for individual companies as well. Her presentations discuss practical implementation of complex engineering concepts into board layout, and methods to improve the overall design and flow of printed circuit boards. She is CID certified and a former writer/columnist for Printed Circuit Design and Fab magazine. Webb is also an active member of the IPC Designer’s Council Executive Board and education committee and is a member and past president of the Houston Chapter of the Designer’s Council.


Course Schedule:

8:30am:  Check-In and Breakfast opens

9:00am - 5:00pm:  Class time

12:00pm - 1:00pm:  Luncheon

5:00pm:  Adjourn 

This course is being held the day before PCB Carolina so you can attend both!

IPC Technical Education PRESENTS - Nov 6


IPC Technical Education: Designing Boards with HDI Technology

This course requires registration and payment thru IPC and is part of their education series.

Exhibit Floor Sold Out !!

Send a note to be added to the waitlist ASAP