2019 Exhibitor List

3G Shielding



​Alan Lupton Associates


American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers


Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group


​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA


​EMA Design Automation

​ERNI Electronics


Firan Technology Group = FTG

Gardner & Meredith

​GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices


Imaginering Inc

​Imperative Product Operations

​Indium Corporation


Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

Mentor, A Siemens Business

METZ Connect USA

MV Circuit Technology


Oak Mitsui Technologies

Oasis Scientific


​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions


Porticos Asia Limited

Printed Circuit Design & Fab



Prototron Circuits


​Rep Inc


Rogers Corporation



Sunshine Global Circuits


​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc


​TTM - Advantage Board Reps


​Wallace Electronic Sales

​Wireless Research Center


NOVEMBER 13th,  Raleigh, NC

Tel:  (919) 342-0810

Session 3A  (9:30 - 10:30, Room 3)

PCBC2018-3A_Sam_To Ground Or Not To Ground.pdf

Speaker: Sam Conner, IBM

Title:  To Ground or Not To Ground (My PCB to Chassis)

Abstract: The merits of single-point versus multi-point grounding of PCBs to the system chassis have been debated for as long as we have been making PCBs. A lot of the evidence provided is anecdotal, and many designers have latched onto one of the design philosophies like a religious belief. In this presentation, we will look at measurement and simulation data and attempt to understand the impacts to EMI, ESD, and SI for today's high-speed, high-density electronic systems. A clear winner might emerge from the data, but will anyone believe it?

Bio:  Sam Connor received his BSEE from the University of Notre Dame in 1994 and his MSEE from Purdue University in 2017. He works for IBM in Research Triangle Park, NC, where he is a Senior Technical Staff Member responsible for EMC design strategy and the development of EMC analysis tools. Sam has co-authored numerous papers in the areas of power distribution network design, common-mode filter design, and high-speed signaling issues in PCB designs. He is a Senior Member of the IEEE, a past chair of TC-9 and the Eastern North Carolina Chapter of the EMC Society, and a former Distinguished Lecturer of the EMC Society.