​​​Major Sponsors

Mentor​

3G Shielding

ACDI

​Alan Lupton Associates

American Circuits

Amitron Corporartion

Aurora Technical Sales

Better Boards​

Carolina Electronic Assemblers

Circuit Technology

DNA Group

​EIT

Electronic Interconnect

EMA

​EMA Design Automation

Gardner & Meredith

IES

Imaginering Inc

Keysight Technologies

Mentor, A Siemens Business

METZ Connect USA

Oak Mitsui Technologies

Oasis Scientific

Printed Circuit Design

PalPilot

​RBB

Risho

Rogers Corporation

SEP Co LTD

Sunshine Global Circuits

​Wallace Electronic Sales

​Wireless Research Center


2019 Exhibitor List

Tel:  (919) 342-0810

Session 3A  (9:30 - 10:30, Room 3)

PCBC2018-3A_Sam_To Ground Or Not To Ground.pdf


Speaker: Sam Conner, IBM


Title:  To Ground or Not To Ground (My PCB to Chassis)


Abstract: The merits of single-point versus multi-point grounding of PCBs to the system chassis have been debated for as long as we have been making PCBs. A lot of the evidence provided is anecdotal, and many designers have latched onto one of the design philosophies like a religious belief. In this presentation, we will look at measurement and simulation data and attempt to understand the impacts to EMI, ESD, and SI for today's high-speed, high-density electronic systems. A clear winner might emerge from the data, but will anyone believe it?


Bio:  Sam Connor received his BSEE from the University of Notre Dame in 1994 and his MSEE from Purdue University in 2017. He works for IBM in Research Triangle Park, NC, where he is a Senior Technical Staff Member responsible for EMC design strategy and the development of EMC analysis tools. Sam has co-authored numerous papers in the areas of power distribution network design, common-mode filter design, and high-speed signaling issues in PCB designs. He is a Senior Member of the IEEE, a past chair of TC-9 and the Eastern North Carolina Chapter of the EMC Society, and a former Distinguished Lecturer of the EMC Society.