2019 Exhibitor List

3G Shielding

ACDI

Aerotek

​Alan Lupton Associates

​Altium

American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

CertifiGroup

Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group

​EIT

​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

​ERNI Electronics

​Fineline-USA

Firan Technology Group = FTG

Gardner & Meredith

​GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices

IES

Imaginering Inc

​Imperative Product Operations

​Indium Corporation

​IPC

Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

Mentor, A Siemens Business

METZ Connect USA

MV Circuit Technology

​Nelson-Miller

Oak Mitsui Technologies

Oasis Scientific

PalPilot

​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions

​Porticos

Porticos Asia Limited

Printed Circuit Design & Fab

​ProtoLabs

ProTronics

Prototron Circuits

​RBB

​Rep Inc

Risho

Rogers Corporation

​Samtec

SEP Co LTD

Sunshine Global Circuits

Tektronix

​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc

TriMech

​TTM - Advantage Board Reps

​Wakefield-Vette

​Wallace Electronic Sales

​Wireless Research Center

​​

NOVEMBER 13th,  Raleigh, NC

Tel:  (919) 342-0810

Session 3A  (9:30 - 10:30, Room 3)

PCBC2018-3A_Sam_To Ground Or Not To Ground.pdf


Speaker: Sam Conner, IBM


Title:  To Ground or Not To Ground (My PCB to Chassis)


Abstract: The merits of single-point versus multi-point grounding of PCBs to the system chassis have been debated for as long as we have been making PCBs. A lot of the evidence provided is anecdotal, and many designers have latched onto one of the design philosophies like a religious belief. In this presentation, we will look at measurement and simulation data and attempt to understand the impacts to EMI, ESD, and SI for today's high-speed, high-density electronic systems. A clear winner might emerge from the data, but will anyone believe it?


Bio:  Sam Connor received his BSEE from the University of Notre Dame in 1994 and his MSEE from Purdue University in 2017. He works for IBM in Research Triangle Park, NC, where he is a Senior Technical Staff Member responsible for EMC design strategy and the development of EMC analysis tools. Sam has co-authored numerous papers in the areas of power distribution network design, common-mode filter design, and high-speed signaling issues in PCB designs. He is a Senior Member of the IEEE, a past chair of TC-9 and the Eastern North Carolina Chapter of the EMC Society, and a former Distinguished Lecturer of the EMC Society.