​​​Major Sponsors


2019 Exhibitor List

Tel:  (919) 342-0810

Session 3B  (11:00 - 12:00, Room 3)

PCBC2018-3B_Mazen_3GSS NC1.pdf

Speaker: Mazen Shehaiber, VP of Engineering - 3G Shielding Specialties 

Title:EMI shielding for High-Frequency Applications

Abstract: While board level shielding is the most common and cost effective method of mitigating RF/EMI interference it often becomes ineffective in high-frequency applications. As a result, engineers must rely on relatively expensive solutions such as machined housings which also have the disadvantages of increased weight and board footprint. As an alternative hybrid shielding offers the same performance as machined housings with a significant cost savings using the footprint of a traditional metal shield.

Bio: Mazen Shehaiber is the VP of Engineering at 3G, where he works with clients to provide shielding solutions for their needs. Mazen graduated from Ryerson University, with a bachelor degree in Mechanical Engineering in 2004. Mazen has been working with 3G since 2005 and has assumed multiple roles from Quality, manufacturing, R&D, design engineering and application engineering. 

3G Shielding


​Alan Lupton Associates

American Circuits

Amitron Corporartion

Aurora Technical Sales

Better Boards​

Carolina Electronic Assemblers

Circuit Technology

DNA Group


Electronic Interconnect


​EMA Design Automation

Gardner & Meredith


Imaginering Inc

Keysight Technologies

Mentor, A Siemens Business

METZ Connect USA

Oak Mitsui Technologies

Oasis Scientific

Printed Circuit Design




Rogers Corporation


Sunshine Global Circuits

​Wallace Electronic Sales

​Wireless Research Center