2019 Exhibitor List

3G Shielding

ACDI

Aerotek

​Alan Lupton Associates

​Altium

American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

CertifiGroup

Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group

​EIT

​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

​ERNI Electronics

​Fineline-USA

Firan Technology Group = FTG

Gardner & Meredith

​GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices

IES

Imaginering Inc

​Imperative Product Operations

​Indium Corporation

​IPC

Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

Mentor, A Siemens Business

METZ Connect USA

MV Circuit Technology

​Nelson-Miller

Oak Mitsui Technologies

Oasis Scientific

PalPilot

​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions

​Porticos

Porticos Asia Limited

Printed Circuit Design & Fab

​ProtoLabs

ProTronics

Prototron Circuits

​RBB

​Rep Inc

Risho

Rogers Corporation

​Samtec

SEP Co LTD

Sunshine Global Circuits

Tektronix

​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc

TriMech

​TTM - Advantage Board Reps

​Wakefield-Vette

​Wallace Electronic Sales

​Wireless Research Center

​​

NOVEMBER 13th,  Raleigh, NC

Tel:  (919) 342-0810

Session 3D  (3:30 - 4:30, Room 3)

PCBC2018-3D_Paul_FTG.pdf


Speaker: Paul Cooke, Firan Technology Group (FTG), Director of FAE and Tech Sales


Title:The Basics of PCB Fabrication (101)


Abstract:  With ever decreasing geometries and increased density, todays printed circuit boards (PCB’s) are extremely complex. Fabricators are continually under pressure to keep up with the capabilities needed to produce these types of products.  This seminar looks at how a PCB is fabricated and the challenges the fabricator faces to achieve the design intent and meet the customer and industry standards. We will examine the processes needed to form microvia’s,  image micro bga’s, plate copper in holes the thickness of a human hair and select surface finishes needed for very tight pitch components. The half day seminar will be interactive with the audience to ensure any and all questions related to more in depth PCB fabrication and processes are answered.


Bio:  PAUL COOKE has more than 30 years of experience in printed board (PWB) design and manufacturing. Paul has held senior positions in operations, quality, process engineering and field application engineering, at some of the top North American PCB manufacturers. He has served on a number of IPC technical committees for the development of standards for the industry, having recently received an award for contribution to IPC-9121, “Troubleshooting for Printed Circuit Boards.” He has co-authored numerous technical papers, and works with Tier 1 companies, focusing on PCB design and reliability. He has provided DfM consulting services to the industry, along with extensive training/educational presentations from PCB 101 through enhanced reliability. His current position is focused solely on working with designers in the avionics and space industry to design and develop products with extended life and long-term reliability in harsh environments.