​​​Major Sponsors


Better Boards

 Mentor

2018 Exhibitor List

Tel:  (919) 342-0810​

​​​

​3G Shielding Specialties

ACDi

Adiva Corporation

​Aerotek

Altium

American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology

Compunetics

​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices

​IMDS DATA

Indium Corporation

IPC

​JBC Tools USA

​JMC Tool & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA

Nelson-Miller

​Oasis Scientific

PalPilot

​Panacol-USA

​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions

Porticos

Porticos Asia Limited

​Printed Circuit Design & Fab

​Protolabs

​Pulsonix

​Rep Inc

​Risho

Royal Circuit Solutions

​Samtec

Seltech

​SEP Co

​Tektronix

​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D

​TriMech

​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing


Session 3D  (3:30 - 4:30, Room 3)

PCBC2018-3D_Paul_FTG.pdf


Speaker: Paul Cooke, Firan Technology Group (FTG), Director of FAE and Tech Sales


Title:The Basics of PCB Fabrication (101)


Abstract:  With ever decreasing geometries and increased density, todays printed circuit boards (PCB’s) are extremely complex. Fabricators are continually under pressure to keep up with the capabilities needed to produce these types of products.  This seminar looks at how a PCB is fabricated and the challenges the fabricator faces to achieve the design intent and meet the customer and industry standards. We will examine the processes needed to form microvia’s,  image micro bga’s, plate copper in holes the thickness of a human hair and select surface finishes needed for very tight pitch components. The half day seminar will be interactive with the audience to ensure any and all questions related to more in depth PCB fabrication and processes are answered.


Bio:  PAUL COOKE has more than 30 years of experience in printed board (PWB) design and manufacturing. Paul has held senior positions in operations, quality, process engineering and field application engineering, at some of the top North American PCB manufacturers. He has served on a number of IPC technical committees for the development of standards for the industry, having recently received an award for contribution to IPC-9121, “Troubleshooting for Printed Circuit Boards.” He has co-authored numerous technical papers, and works with Tier 1 companies, focusing on PCB design and reliability. He has provided DfM consulting services to the industry, along with extensive training/educational presentations from PCB 101 through enhanced reliability. His current position is focused solely on working with designers in the avionics and space industry to design and develop products with extended life and long-term reliability in harsh environments.