2019 Exhibitor List

3G Shielding

ACDI

Aerotek

​Alan Lupton Associates

​Altium

American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

CertifiGroup

Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group

​EIT

​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

​ERNI Electronics

​Fineline-USA

Firan Technology Group = FTG

Gardner & Meredith

​GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices

IES

Imaginering Inc

​Imperative Product Operations

​Indium Corporation

​IPC

Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

Mentor, A Siemens Business

METZ Connect USA

MV Circuit Technology

​Nelson-Miller

Oak Mitsui Technologies

Oasis Scientific

PalPilot

​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions

​Porticos

Porticos Asia Limited

Printed Circuit Design & Fab

​ProtoLabs

ProTronics

Prototron Circuits

​RBB

​Rep Inc

Risho

Rogers Corporation

​Samtec

SEP Co LTD

Sunshine Global Circuits

Tektronix

​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc

TriMech

​TTM - Advantage Board Reps

​Wakefield-Vette

​Wallace Electronic Sales

​Wireless Research Center

​​

NOVEMBER 13th,  Raleigh, NC

Tel:  (919) 342-0810

Session 4A  (9:30 - 10:30, Room 4)

PCBC2018-4A_Bill_Creative Electron X-ray factor.pdf


Speaker: Dr. Bill Cardoso, Creative Electron


Title:  The X-Factor - How X-ray Technology is Improving the Electronics Assembly Process


Abstract:  It was 1895 when Wilhelm Roentgen discovered a mysterious light that allowed him to see through things – and called it x-rays. Since then, x-rays have been adopted in a wide range of applications in the electronics assembly process. Instead of taking a “deep-dive” in one aspect of x-ray inspection, in this presentation we’ll cover a broad range of applications: 
- Electronic component inspection and failure analysis.
- Component counting and material management.
- Reverse engineering.
- Counterfeit detection.
- Real-time defect verification.
- Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection.
- Design for manufacturing (DFM) and design for x-ray inspection (DFXI).
- Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). 
We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are now reality by combining AI and x-ray inspection. Moreover, we will show you a series of real-life cases on how our team of AI scientists is using AI to solve the most challenging applications in x-ray inspection. And beyond x-ray inspection, we’ll examine how AI is forever changing the way we manufacture and inspect things.


Bio:  Bill started his first company at 17 in Brazil, selling it a few years later to work for US Department of Energy’s Fermi National Accelerator Laboratory (Fermilab). At Fermilab Bill led research in nuclear physics to build the equipment that discovered the Higgs Boson (and the 2013 Nobel Prize in Physics). After 10 years at Fermilab, Bill was ready to get back to the entrepreneurial life.  He moved from Chicago to sunny San Diego to start Creative Electron in his garage in 2008. Creative Electron is 10 years old now, and after the acquisition of FocalSpot in 2016, it became the largest US manufacturer of x-ray systems to the electronics industry. Creative Electron’s fast growth has been driven by its artificial intelligence expertise combined by a core competency in x-ray inspection. At Creative Electron, Bill leads the team of engineers and scientists who combine AI and x-rays to deliver the most intelligent x-ray machines in the market. 
Bill received his Associate’s Degree at 13 and went on to achieve a BS, MS, and PhD in Electrical and Computer Engineering. Bill also has his MBA from University of Chicago.  He is a recipient of the Outstanding Alumnus Award from IIT, and sits on the technical committees of SMTAI, SMTA Counterfeit Conference, and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He’s on the Board of Directors of the MiraCosta College and on the Board of Advisors at the Illinois Institute of Technology. He is also an officer with the San Diego chapter of the SMTA. Bill has written two books and over 150 technical publications.