2019 Exhibitor List

3G Shielding

ACDI

Aerotek

​Alan Lupton Associates

​Altium

American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

CertifiGroup

Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group

​EIT

​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

​ERNI Electronics

​Fineline-USA

Firan Technology Group = FTG

Gardner & Meredith

​GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices

IES

Imaginering Inc

​Imperative Product Operations

​Indium Corporation

​IPC

Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

Mentor, A Siemens Business

METZ Connect USA

MV Circuit Technology

​Nelson-Miller

Oak Mitsui Technologies

Oasis Scientific

PalPilot

​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions

​Porticos

Porticos Asia Limited

Printed Circuit Design & Fab

​ProtoLabs

ProTronics

Prototron Circuits

​RBB

​Rep Inc

Risho

Rogers Corporation

​Samtec

SEP Co LTD

Sunshine Global Circuits

Tektronix

​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc

TriMech

​TTM - Advantage Board Reps

​Wakefield-Vette

​Wallace Electronic Sales

​Wireless Research Center

​​

NOVEMBER 13th,  Raleigh, NC

Tel:  (919) 342-0810

Session 4B  (11:00 - 12:00, Room 4)

Session 4C  (2:00 - 3:00, Room 4)

PCBC2018-4B-4C_Gary_Designing Reliability In, at the Designer Level.pdf


Speaker: Gary Ferrari, FTG Circuits


Title:  Designing Reliability In, at the Designer Level (Part 1 & 2)


Abstract: Today’s designers face significant challenges in their designs. They are faced with circuits consisting of low and high circuit densities, digital and  analog circuits, high speed, and micro wave circuits, to name a few. To complicate our efforts, we have rigid, flexible, and rigid/flex circuit boards. These technologies share a common goal; cost, performance, and reliability over time.
These everyday challenges make  it easy for one to overlook the importance of reliability. Let’s face it; reliability has to be designed into a product, not inspected into it. 
This session will explore several factors that affect the reliability of a product. Lastly, we will look at new and innovative ways to test and verify a product’s integrity in both leaded and lead free products. 
What you will learn
- A clear understanding of overall DFM issues that affect product Reliability
- How to apply learned principles to your designs
- Lead free DFM/DFR considerations


Bio: Gary has over 45 years’ experience in electronic packaging with an emphasis on printed board (PWB) design and manufacturing. He has held senior Operations, Quality and Engineering positions in both OEM and supplier based environments: most recently, as the past Executive Director and Co-Founder of the IPC Designers Council. He served as chairman of the IPC Technical Activities Executive Committee, guiding IPC technical activities during his term. He has written numerous technical articles, and has provided design for manufacture (DFM) consulting services to the industry.  Gary spearheaded IPC's highly successful PWB Designers Certification Program, which has trained and recognized over 6000 designers to date.

Gary was honored with the IPC “President’s Award” in 1990, and the IPC Raymond E. Pritchard Hall of Fame Award in 2015, recognizing his contributions to the electronic interconnection industry, as well as to the association.