​​​Major Sponsors

Better Boards



​3G Shielding Specialties


Adiva Corporation



American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology


​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA


​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices


Indium Corporation


​JBC Tools USA

​JMC Tool & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA


​Oasis Scientific



​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions


Porticos Asia Limited

​Printed Circuit Design & Fab



​Rep Inc


Royal Circuit Solutions





​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D


​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing

2018 Exhibitor List

Tel:  (919) 342-0810​

Session 4B  (11:00 - 12:00, Room 4)

Session 4C  (2:00 - 3:00, Room 4)

PCBC2018-4B-4C_Gary_Designing Reliability In, at the Designer Level.pdf

Speaker: Gary Ferrari, FTG Circuits

Title:  Designing Reliability In, at the Designer Level (Part 1 & 2)

Abstract: Today’s designers face significant challenges in their designs. They are faced with circuits consisting of low and high circuit densities, digital and  analog circuits, high speed, and micro wave circuits, to name a few. To complicate our efforts, we have rigid, flexible, and rigid/flex circuit boards. These technologies share a common goal; cost, performance, and reliability over time.
These everyday challenges make  it easy for one to overlook the importance of reliability. Let’s face it; reliability has to be designed into a product, not inspected into it. 
This session will explore several factors that affect the reliability of a product. Lastly, we will look at new and innovative ways to test and verify a product’s integrity in both leaded and lead free products. 
What you will learn
- A clear understanding of overall DFM issues that affect product Reliability
- How to apply learned principles to your designs
- Lead free DFM/DFR considerations

Bio: Gary has over 45 years’ experience in electronic packaging with an emphasis on printed board (PWB) design and manufacturing. He has held senior Operations, Quality and Engineering positions in both OEM and supplier based environments: most recently, as the past Executive Director and Co-Founder of the IPC Designers Council. He served as chairman of the IPC Technical Activities Executive Committee, guiding IPC technical activities during his term. He has written numerous technical articles, and has provided design for manufacture (DFM) consulting services to the industry.  Gary spearheaded IPC's highly successful PWB Designers Certification Program, which has trained and recognized over 6000 designers to date.

Gary was honored with the IPC “President’s Award” in 1990, and the IPC Raymond E. Pritchard Hall of Fame Award in 2015, recognizing his contributions to the electronic interconnection industry, as well as to the association.