​​​Major Sponsors

Mentor​

3G Shielding

ACDI

​Alan Lupton Associates

American Circuits

Amitron Corporartion

Aurora Technical Sales

Better Boards​

Carolina Electronic Assemblers

Circuit Technology

DNA Group

​EIT

Electronic Interconnect

EMA

​EMA Design Automation

Gardner & Meredith

IES

Imaginering Inc

Keysight Technologies

Mentor, A Siemens Business

METZ Connect USA

Oak Mitsui Technologies

Oasis Scientific

Printed Circuit Design

PalPilot

​RBB

Risho

Rogers Corporation

SEP Co LTD

Sunshine Global Circuits

​Wallace Electronic Sales

​Wireless Research Center


2019 Exhibitor List

Tel:  (919) 342-0810

Session 4B  (11:00 - 12:00, Room 4)

Session 4C  (2:00 - 3:00, Room 4)

PCBC2018-4B-4C_Gary_Designing Reliability In, at the Designer Level.pdf


Speaker: Gary Ferrari, FTG Circuits


Title:  Designing Reliability In, at the Designer Level (Part 1 & 2)


Abstract: Today’s designers face significant challenges in their designs. They are faced with circuits consisting of low and high circuit densities, digital and  analog circuits, high speed, and micro wave circuits, to name a few. To complicate our efforts, we have rigid, flexible, and rigid/flex circuit boards. These technologies share a common goal; cost, performance, and reliability over time.
These everyday challenges make  it easy for one to overlook the importance of reliability. Let’s face it; reliability has to be designed into a product, not inspected into it. 
This session will explore several factors that affect the reliability of a product. Lastly, we will look at new and innovative ways to test and verify a product’s integrity in both leaded and lead free products. 
What you will learn
- A clear understanding of overall DFM issues that affect product Reliability
- How to apply learned principles to your designs
- Lead free DFM/DFR considerations


Bio: Gary has over 45 years’ experience in electronic packaging with an emphasis on printed board (PWB) design and manufacturing. He has held senior Operations, Quality and Engineering positions in both OEM and supplier based environments: most recently, as the past Executive Director and Co-Founder of the IPC Designers Council. He served as chairman of the IPC Technical Activities Executive Committee, guiding IPC technical activities during his term. He has written numerous technical articles, and has provided design for manufacture (DFM) consulting services to the industry.  Gary spearheaded IPC's highly successful PWB Designers Certification Program, which has trained and recognized over 6000 designers to date.

Gary was honored with the IPC “President’s Award” in 1990, and the IPC Raymond E. Pritchard Hall of Fame Award in 2015, recognizing his contributions to the electronic interconnection industry, as well as to the association.