​​​Major Sponsors

Better Boards



​3G Shielding Specialties


Adiva Corporation



American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology


​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA


​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices


Indium Corporation


​JBC Tools USA

​JMC Tool & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA


​Oasis Scientific



​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions


Porticos Asia Limited

​Printed Circuit Design & Fab



​Rep Inc


Royal Circuit Solutions





​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D


​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing

2018 Exhibitor List

Tel:  (919) 342-0810​

Session 4C  (2:00 - 3:00, Room 4)


Speaker: Gary Ferrari, Ferrari Technical Services

Title: Lead-Free Impact on Design for High Reliability Applications - Part 1

Abstract: The RoHS directive is proving to affect all segments of the product development cycle. Granted, some areas are affected more than others. The very designs created by printed board designers have a profound affect on the final product. This seminar will provide an overview of those areas that are affected most by the RoHS directive, and what the designer needs to understand to create manufacturable designs. Included in the discussion is material selection, surface finishes, component selection and placement, to name a few.
What You Will Learn:
- Laminate material issues
- Surface finish issues
- Component issues
- Assembly issues

Bio: Gary Ferrari is the past executive director and co-founder of the IPC Designers Council and has more than 37 years of experience in electronic packaging with an emphasis on printed board (PWB) design and manufacturing. He has chaired a number of IPC technical committees, including the Printed Board Design Committee, the Computer Aided Design Subcommittee, the Printed Board Complexity Committee, the IPC-D-275 Design Subcommittee and the Technical Activities Executive Committee. He has written numerous technical articles, and has provided design for manufacture (DFM) consulting services to the industry.  Gary spearheaded IPC's highly successful PWB Designers Certification Program, which has trained and recognized over 1,900 designers to date. Ferrari was honored with the IPC "President's Award" in 1990, recognizing his contributions to the electronic interconnection industry, as well as to the association.