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Session 5B  (11:00 - 12:00, Room 5)


Speaker: Dr. Douglas Hopkins, NSF FREEDM Systems Center

Title: Misconception of Thermal Spreading Angle and Misapplication to PCB & Power

Abstract: The widely used 45 degrees thermal spreading model assumption provides up to 20% conservative error of thermal resistance for a certain substrate layer thickness range, but is not applicable to multi-layered structures. An in-depth literature review was conducted and little, if any, concrete basis for the 45 degree assumption was found. Guidelines for using more accurate spreading-angle calculations are provided for the practicing engineer. Also, new easy to apply multiphysics simulator products are described through examples, and focused to help advance small businesses.

Bio: Prof. Hopkins has over 20 years of academic and industrial experience focused on high-frequency, high density power electronics with emphasis on packaging. He received his Ph.D.-EE from Virginia Tech, and spent his early career at the R&D centers of GE and Carrier Air-Conditioning Companies. He now directs the Laboratory for “Packaging Research in Electronic Energy Systems” at NC State University. He has published over 120 journal and conference articles, a number recognized with awards, and is an IMAPS Fellow.

2018 Exhibitor List

Tel:  (919) 342-0810​


​3G Shielding Specialties


Adiva Corporation


Alan Lupton Associates


American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology


​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA


​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices


Indium Corporation


​JBC Tools USA

​JMC Too & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA


​Oasis Scientific



​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions


Porticos Asia Limited

​Printed Circuit Design & Fab



​Rep Inc


Royal Circuit Solutions




​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D


​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing