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​3G Shielding Specialties


Adiva Corporation


Alan Lupton Associates


American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology


​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA


​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices


Indium Corporation


​JBC Tools USA

​JMC Too & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA


​Oasis Scientific



​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions


Porticos Asia Limited

​Printed Circuit Design & Fab



​Rep Inc


Royal Circuit Solutions




​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D


​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing

2018 Exhibitor List

Tel:  (919) 342-0810​

Session 5D  (3:30 - 4:30, Room 5)


Speaker: Will Webb, Astor Technologies

Title: How to build a consistent 'design-to-test' flow in order to deliver defect-free PCBA's

Abstract: Design for Excellence (DfX) can be used as part of an organization’s Continuous Improvement Program to decrease product development time, product cost and manufacturing cycle time, while increasing product quality, reliability and ultimately the customer satisfaction.
It will significantly decrease the overall cycle time from the design concept to customer delivery, which is a critical success factor. Design for Excellence makes it possible to implement a Lean Test approach that produces a lower cost product whilst maintaining the highest quality.
Our vision is articulated on two principles:  Using traceability and repair loop information in order to qualify the customer defect universe. The defects include design defects, manufacturing defects and functional defects.  Importing the defect opportunities and identifying the possible consequences of inadequate testability and test coverage on a new design.

Bio: Will Webb has worked in the manufacturing test industry for over 16 years and is now employed by ASTER Technologies as the Technical Director of the ASTER USA office.  Will is responsible for technical support and creating new business opportunities for the 'TestWay' Electrical DfT and Fault Coverage Analysis tools.  Prior to working for Aster Technologies, Will has worked for a number of different OEMs and CM's in the manufacturing test field responsible for DFT analysis, test development, and overseas deployment.