2019 Exhibitor List

3G Shielding

ACDI

Aerotek

​Alan Lupton Associates

​Altium

American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

CertifiGroup

Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group

​EIT

​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

​ERNI Electronics

​Fineline-USA

Firan Technology Group = FTG

Gardner & Meredith

​GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices

IES

Imaginering Inc

​Imperative Product Operations

​Indium Corporation

​IPC

Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

Mentor, A Siemens Business

METZ Connect USA

MV Circuit Technology

​Nelson-Miller

Oak Mitsui Technologies

Oasis Scientific

PalPilot

​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions

​Porticos

Porticos Asia Limited

Printed Circuit Design & Fab

​ProtoLabs

ProTronics

Prototron Circuits

​RBB

​Rep Inc

Risho

Rogers Corporation

​Samtec

SEP Co LTD

Sunshine Global Circuits

Tektronix

​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc

TriMech

​TTM - Advantage Board Reps

​Wakefield-Vette

​Wallace Electronic Sales

​Wireless Research Center

​​

NOVEMBER 13th,  Raleigh, NC

Tel:  (919) 342-0810

Session 6A  (9:30 - 10:30, Room 6)

PCBC2018-6A_Andrea-Brian_EPC_.pdf


Speakers:

Andrea Mirenda, Vice President of Americas Sales, EPC

​Brian Miller, Field Applications Engineer, EPC


Title:  Differentiating Your Design with New Performance Levels using GaN Power Solutions


Abstract:  State-of-the-art solutions, such as GaN power FETs and ICs, enable engineers to enhance their competitive advantage.  In this session, see what Gallium Nitride (GaN) power solutions offer in terms of size, speed, efficiency and power density.  Board layout examples show how to take advantage of EPC’s 15-350 V GaN FETs’ low parasitics.  Explore how GaN power semiconductors are smaller and more efficient than silicon solutions, and see practical examples of applications such as: power supplies, Class D audio amplifiers, LiDAR, resonant Wireless Power transfer and motor control.  A vast palette of opportunity for your next design!

​​

Bios:

Andrea Mirenda has over 30 years of semiconductor industry experience ranging from power semiconductors and sophisticated power modular technologies to microprocessors, microcontrollers, integrated chipsets and memory products.  Her past experience includes vice president of corporate marketing and vice president of EMS sales for Fairchild Semiconductor and vice president of marketing at Vishay Siliconix.  Andrea holds a degree in sociobiology and environmental planning from the University of California at Santa Cruz.


​Brian Miller is a Field Applications Engineer for the Eastern U.S. and Canada for Efficient Power Conversion Corp (EPC), the leading manufacturer of GaN power FETs.  He has been with EPC for 2 years.  Previously he was a power electronics design engineer for IBM (RTP, N. Carolina) ThinkPad notebook PC group, and for Sony-Ericsson (RTP, N. Carolina) mobile phone development group.  He also was previously a field application engineer for Semtech Corp.  Brian received his undergraduate and master’s degrees in electrical engineering from Duke University, in Durham, North Carolina.