​​​Major Sponsors

Better Boards



​3G Shielding Specialties


Adiva Corporation



American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology


​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA


​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices


Indium Corporation


​JBC Tools USA

​JMC Tool & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA


​Oasis Scientific



​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions


Porticos Asia Limited

​Printed Circuit Design & Fab



​Rep Inc


Royal Circuit Solutions





​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D


​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing

2018 Exhibitor List

Tel:  (919) 342-0810​

Session 6A  (9:30 - 10:30, Room 6)



Andrea Mirenda, Vice President of Americas Sales, EPC

​Brian Miller, Field Applications Engineer, EPC

Title:  Differentiating Your Design with New Performance Levels using GaN Power Solutions

Abstract:  State-of-the-art solutions, such as GaN power FETs and ICs, enable engineers to enhance their competitive advantage.  In this session, see what Gallium Nitride (GaN) power solutions offer in terms of size, speed, efficiency and power density.  Board layout examples show how to take advantage of EPC’s 15-350 V GaN FETs’ low parasitics.  Explore how GaN power semiconductors are smaller and more efficient than silicon solutions, and see practical examples of applications such as: power supplies, Class D audio amplifiers, LiDAR, resonant Wireless Power transfer and motor control.  A vast palette of opportunity for your next design!



Andrea Mirenda has over 30 years of semiconductor industry experience ranging from power semiconductors and sophisticated power modular technologies to microprocessors, microcontrollers, integrated chipsets and memory products.  Her past experience includes vice president of corporate marketing and vice president of EMS sales for Fairchild Semiconductor and vice president of marketing at Vishay Siliconix.  Andrea holds a degree in sociobiology and environmental planning from the University of California at Santa Cruz.

​Brian Miller is a Field Applications Engineer for the Eastern U.S. and Canada for Efficient Power Conversion Corp (EPC), the leading manufacturer of GaN power FETs.  He has been with EPC for 2 years.  Previously he was a power electronics design engineer for IBM (RTP, N. Carolina) ThinkPad notebook PC group, and for Sony-Ericsson (RTP, N. Carolina) mobile phone development group.  He also was previously a field application engineer for Semtech Corp.  Brian received his undergraduate and master’s degrees in electrical engineering from Duke University, in Durham, North Carolina.