​​​Major Sponsors


3G Shielding


​Alan Lupton Associates

American Circuits

Amitron Corporartion

Aurora Technical Sales

Better Boards​

Carolina Electronic Assemblers

Circuit Technology

DNA Group


Electronic Interconnect


​EMA Design Automation

Gardner & Meredith


Imaginering Inc

Keysight Technologies

Mentor, A Siemens Business

METZ Connect USA

Oak Mitsui Technologies

Oasis Scientific

Printed Circuit Design




Rogers Corporation


Sunshine Global Circuits

​Wallace Electronic Sales

​Wireless Research Center

2019 Exhibitor List

Tel:  (919) 342-0810

Session 6A  (9:30 - 10:30, Room 6)



Andrea Mirenda, Vice President of Americas Sales, EPC

​Brian Miller, Field Applications Engineer, EPC

Title:  Differentiating Your Design with New Performance Levels using GaN Power Solutions

Abstract:  State-of-the-art solutions, such as GaN power FETs and ICs, enable engineers to enhance their competitive advantage.  In this session, see what Gallium Nitride (GaN) power solutions offer in terms of size, speed, efficiency and power density.  Board layout examples show how to take advantage of EPC’s 15-350 V GaN FETs’ low parasitics.  Explore how GaN power semiconductors are smaller and more efficient than silicon solutions, and see practical examples of applications such as: power supplies, Class D audio amplifiers, LiDAR, resonant Wireless Power transfer and motor control.  A vast palette of opportunity for your next design!



Andrea Mirenda has over 30 years of semiconductor industry experience ranging from power semiconductors and sophisticated power modular technologies to microprocessors, microcontrollers, integrated chipsets and memory products.  Her past experience includes vice president of corporate marketing and vice president of EMS sales for Fairchild Semiconductor and vice president of marketing at Vishay Siliconix.  Andrea holds a degree in sociobiology and environmental planning from the University of California at Santa Cruz.

​Brian Miller is a Field Applications Engineer for the Eastern U.S. and Canada for Efficient Power Conversion Corp (EPC), the leading manufacturer of GaN power FETs.  He has been with EPC for 2 years.  Previously he was a power electronics design engineer for IBM (RTP, N. Carolina) ThinkPad notebook PC group, and for Sony-Ericsson (RTP, N. Carolina) mobile phone development group.  He also was previously a field application engineer for Semtech Corp.  Brian received his undergraduate and master’s degrees in electrical engineering from Duke University, in Durham, North Carolina.