2019 Exhibitor List

3G Shielding



​Alan Lupton Associates


American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers


Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group


​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA


​EMA Design Automation

​ERNI Electronics


Firan Technology Group = FTG

Gardner & Meredith

​GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices


Imaginering Inc

​Imperative Product Operations

​Indium Corporation


Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

Mentor, A Siemens Business

METZ Connect USA

MV Circuit Technology


Oak Mitsui Technologies

Oasis Scientific


​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions


Porticos Asia Limited

Printed Circuit Design & Fab



Prototron Circuits


​Rep Inc


Rogers Corporation



Sunshine Global Circuits


​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc


​TTM - Advantage Board Reps


​Wallace Electronic Sales

​Wireless Research Center


NOVEMBER 13th,  Raleigh, NC

Tel:  (919) 342-0810

Session 6B  (11:00 - 12:00, Room 6)

PCBC2018-6B-6C_Jay_High Speed Serial Channel Measurements.pdf

Speaker: Jay Diepenbrock, SIRF Consultants LLC

Title:  High Speed Serial Channel Measurements - Part 1 & 2

Abstract: This presentation will describe some of the key performance parameters associated with high speed serial channels.  These include time domain impedance, eye opening, and jitter, and frequency domain S-parameters.  A sample channel will be then measured in both the time and frequency domains, displaying the measured data.  The channel’s measured data will be examined in light of some of the relevant standards.  Evidence of channel impairments in the observed, measured data will be pointed out, with possible explanations of potential means of improvement. Actual lab equipment will be used in these presentations.

Bio: Jay Diepenbrock holds a Sc. B. (EE) from Brown University and an MSEE from Syracuse University.  He spent over 35 years at IBM, designing analog, digital, and RF circuits on ICs and printed circuit boards, backplanes, and simulating and testing high speed cables.  He also was a Senior Vice President, High Speed Engineering at Lorom America, a Chinese manufacturer of high speed cables and electronic sub-assemblies.  He contributed to a number of IEEE and industry standards, and published numerous papers in various journals and conferences including PCB Carolina, and holds 12 patents.  He is a Senior Member of the IEEE, and is now an independent consultant with SIRF Consultants, LLC.  In his spare time, he does disaster relief work with the Red Cross and the IEEE MOVE team, photography, woodworking, and jazz music.