​​​Major Sponsors

Better Boards



​3G Shielding Specialties


Adiva Corporation



American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology


​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA


​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices


Indium Corporation


​JBC Tools USA

​JMC Tool & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA


​Oasis Scientific



​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions


Porticos Asia Limited

​Printed Circuit Design & Fab



​Rep Inc


Royal Circuit Solutions





​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D


​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing

2018 Exhibitor List

Tel:  (919) 342-0810​

Session 6B  (11:00 - 12:00, Room 6)

PCBC2018-6B-6C_Jay_High Speed Serial Channel Measurements.pdf

Speaker: Jay Diepenbrock, SIRF Consultants LLC

Title:  High Speed Serial Channel Measurements - Part 1 & 2

Abstract: This presentation will describe some of the key performance parameters associated with high speed serial channels.  These include time domain impedance, eye opening, and jitter, and frequency domain S-parameters.  A sample channel will be then measured in both the time and frequency domains, displaying the measured data.  The channel’s measured data will be examined in light of some of the relevant standards.  Evidence of channel impairments in the observed, measured data will be pointed out, with possible explanations of potential means of improvement. Actual lab equipment will be used in these presentations.

Bio: Jay Diepenbrock holds a Sc. B. (EE) from Brown University and an MSEE from Syracuse University.  He spent over 35 years at IBM, designing analog, digital, and RF circuits on ICs and printed circuit boards, backplanes, and simulating and testing high speed cables.  He also was a Senior Vice President, High Speed Engineering at Lorom America, a Chinese manufacturer of high speed cables and electronic sub-assemblies.  He contributed to a number of IEEE and industry standards, and published numerous papers in various journals and conferences including PCB Carolina, and holds 12 patents.  He is a Senior Member of the IEEE, and is now an independent consultant with SIRF Consultants, LLC.  In his spare time, he does disaster relief work with the Red Cross and the IEEE MOVE team, photography, woodworking, and jazz music.