Exhibit Floor Sold Out !!

Send a note to be added to the waitlist ASAP

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​3G Shielding Specialties

ACDi

Adiva Corporation

​Aerotek

Alan Lupton Associates

Altium

American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology

Compunetics

​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices

​IMDS DATA

Indium Corporation

IPC

​JBC Tools USA

​JMC Too & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA

Nelson-Miller

​Oasis Scientific

PalPilot

​Panacol-USA

​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions

Porticos

Porticos Asia Limited

​Printed Circuit Design & Fab

​Protolabs

​Pulsonix

​Rep Inc

​Risho

Royal Circuit Solutions

​Samtec

​SEP Co

​Tektronix

​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D

​TriMech

​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing


2018 Exhibitor List

Tel:  (919) 342-0810​

Session 6D  (3:30 - 4:30, Room 6)

MEMs_Components_and_IMUs.pdf


Speaker: Bob Scannell, Analog Devices


Title: ADI High Performance Inertial Sensors -  A breakthrough generation of MEMs Components and IMUs


Abstract: ADI High Performance Inertial Sensors are uniquely positioned in industry to solve critical precision requirements within autonomous machinery and instrumentation applications.  ADI technology has unique advantages in providing stability within complex environments and challenging motion dynamics.  This session will provide  technology insights on performance enabling specifications and features, in the context of compelling new application requirements. 


Bio: Bob Scannell is a business development manager for ADI’s MEMS inertial sensor products. He has been with ADI for over 20 years in various technical marketing and business development functions, ranging from sensors to DSP to Wireless, and previously worked at Rockwell International in both design and marketing. He holds a bachelor of science degree in electrical engineering from UCLA (University of California, Los Angeles), and a master of science in computer engineering from USC (University of Southern California).