2019 Exhibitor List

3G Shielding

ACDI

Aerotek

​Alan Lupton Associates

​Altium

American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

CertifiGroup

Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group

​EIT

​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

​ERNI Electronics

​Fineline-USA

Firan Technology Group = FTG

Gardner & Meredith

​GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices

IES

Imaginering Inc

​Imperative Product Operations

​Indium Corporation

​IPC

Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

Mentor, A Siemens Business

METZ Connect USA

MV Circuit Technology

​Nelson-Miller

Oak Mitsui Technologies

Oasis Scientific

PalPilot

​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions

​Porticos

Porticos Asia Limited

Printed Circuit Design & Fab

​ProtoLabs

ProTronics

Prototron Circuits

​RBB

​Rep Inc

Risho

Rogers Corporation

​Samtec

SEP Co LTD

Sunshine Global Circuits

Tektronix

​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc

TriMech

​TTM - Advantage Board Reps

​Wakefield-Vette

​Wallace Electronic Sales

​Wireless Research Center

​​

Tel:  (919) 342-0810

Keynote Address  (8:30 - 9:15, Room 2)

PCBC2018-Keynote_Rick_Hartley.pdf


Speaker: Rick Hartley, RHartley Enterprises 


Title: Almost No One Uses the Right Stack-Up 


Abstract:  Of all the items we control in a PC board design, that which matters most is Stack-up.  Yes, placement, routing and other features are critical, but if board stack is compromised, all other features, by definition, are compromised.  Proper board stack must lead the way.
In this keynote we will discuss why those statements are true, as well as how to craft an ideal board stack-up, be it 2 layers, 4 layers, 6 layers or 60 layers.  We will also discuss why some of the most commonly used 4 and 6 layer board stack-ups are a disastrously bad idea and why they cause interference.  More importantly, how to fix them!


Bio:  Rick Hartley is the principal of RHartley Enterprises, through which he consults and teaches internationally.  Rick’s focus is on correct design of circuits and PC boards to prevent and/or resolve EMI, noise and signal integrity problems.  He has consulted with major corporations in the US and 12 other countries.  His career focused on computers, telecommunications and aircraft avionics, as well as the automotive and appliance space.  Rick has taught seminars at numerous conferences, including the IEEE EMC Symposium, PCB West, IPC Carolina, IPC Apex/Expo and others.  He is a member of the IPC DC Board of Directors, a past member of the Editorial Review Board of Printed Circuit Design Magazine and has written numerous technical papers and articles on methods to control noise, EMI and signal integrity.


NOVEMBER 13th,  Raleigh, NC