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​​​

​3G Shielding Specialties

ACDi

Adiva Corporation

​Aerotek

Alan Lupton Associates

Altium

American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology

Compunetics

​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices

​IMDS DATA

Indium Corporation

IPC

​JBC Tools USA

​JMC Too & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA

Nelson-Miller

​Oasis Scientific

PalPilot

​Panacol-USA

​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions

Porticos

Porticos Asia Limited

​Printed Circuit Design & Fab

​Protolabs

​Pulsonix

​Rep Inc

​Risho

Royal Circuit Solutions

​Samtec

​SEP Co

​Tektronix

​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D

​TriMech

​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing


2018 Exhibitor List

Tel:  (919) 342-0810​

TECHNICAL SCHEDULE

Presentor Company Topic ROOM
Keynote
8:30-9:15
Susan Sanford Research Triangle Cleantech Cluster  Regional Innovation, Global Application: How the Research Triangle Region is Solving the World's Most Critical Problems  6
SESSION
A

9:30
|
10:30
Bob Carter Oak-Mitsui Thin PCB Dielectric Technology
and Embedded Capacitance
3
Greg Smith Blue Ring Stencils Improve SMT Assembly Yields Using
Root Cause Analysis in Stencil Design
4
John McMillan Mentor  Optimizing ECAD-MCAD Collaboration
for a Competitive Advantage
5
Jay Diepenbrock Independent Signal
Integrity Consultant
Design Challenges at 56 Gb/s and Beyond 6
SESSION
B

11:00
|
12:00
Bruce Mahler  Ohmega
Technologies 
Embedded Resistors in PCB's--An update
on applications and future design trends
3
Mike Catrambone  Cadence Shorten Time to Design Your PCBs by
Identifying DFx Issues Earlier in the Design Cycle
4
Dr. Douglas Hopkins NSF FREEDM
Systems Center
Misconception of Thermal Spreading Angle and Misapplication to PCBs and Power Modules 5
Eric Tsuei
Goodspeed Kan
Luxshare-ICT Antenna Design Techniques and Experience 6
SESSION
C

2:00
|
3:00
Craig Armenti  Mentor Rigid-Flex PCB Design – Practical
Tips and Best Practices
3
Gary Ferrari Ferrari
Technical Services
Lead-Free Impact on Design for High Reliability Applications - Part 1 4
Matthias Zapatka INGUN USA Usage of spring-loaded contacting solutions
for functional RF- and high current tests
5
Bradley Lane Semtech Real World IoT Solutions
using LoRa and LoRaWAN
6
SESSION
D

3:30
|
4:30
Mike Catrambone  Cadence Routing Complex Interfaces Utilizing
Intelligent Design Planning Techniques
3
Gary Ferrari Ferrari
Technical Services
Lead-Free Impact on Design for High Reliability Applications - Part 2 4
Will Webb Aster
Technologies
How to build a consistent 'design-to-test'
flow in order to deliver defect-free PCBA's
5
Bob Scannell Analog
Devices
ADI High Performance Inertial Sensors -  A breakthrough generation of MEMs and IMUs 6