Please contact Silent Solutions to request a copy of Lee Hill's presentation
Robert Farrell's Presentation will be posted soon.
Technical Session #1 (8:00pm - 9:45pm) Presenter: Lee Hill (Silent Solutions)
Biography:Lee holds an MSEE from the Missouri University of Science and Technology (MS&T) EMC Laboratory, and his company SILENT works on over 35 different product designs per year. His presentation is a great opporutnity to share SILENT's experience, knowledge and education.
Abstract:Myths and Mistakes in Modern PCB Design for Electromagnetic Compatibility (EMC) Lee Hill's presentation will include a number of interesting and entertaining PCB EMC design mistakes and design recommendations. Many of the discussions will include screen shots of actual design problems that were either found, fixed, designed out by SILENT's EMC engineering staff. Lee will also include references to peer-reviewed research and clear explanations of what TO do and what NOT to do in actual physical designs.
Biography:Robert Farrell has a Bachelors of Science in Mechanical Engineering from Union College, a Masters of Science in Mechanical Engineering from Worcester Polytechnic Institute, and a graduate nanotechnology certificate from the University of Massachusetts Lowell. He is an advanced development engineer and has been on the Benchmark Electronics corporate Pb-free team from 2003 to the present and has provided on site support to a number of Benchmark manufacturing facilities as they converted to Pb-free manufacturing and to provide support for SnPb manufacturing. Robert has been an active member of the New England Lead Free Electronics consortium based at the University of Massachusetts Lowell from 2004 until the present and he has worked closely with the Center for Advanced Life Cycle Engineering (CALCE) based at the University of Maryland on a number of projects including Part on Part (PoP), alternative Pb-free alloys, and a nanotechnology based surface finish for printed circuit boards and component lead frames. He has extensive experience developing SnPb and Pb-free rework processes for through hole components and BGA’s. Robert is a co-author of Chapter 6 of the book “Green Electronics Design and Manufacturing” by Dr Sammy Shina and he has made a number of technical presentations at IPC, IMAPS, SMTA, IEEE, and CALCE conferences.
Abstract:Conversion of a High Reliability Exempt Products to Lead-Free: Lessons Learned - 4 Years into RoHS The Restriction of Hazardous Substances (RoHS) took effect in July of 2006 requiring many products sold in the European Union to be Lead (Pb) Free.However, a number of products were exempt including Product A from Customer A and the exemption is valid until 2012 at the earliest.Product A is a high reliability network communications product designed to have a 25 year life in Central Office conditions in which the operational temperatures can vary between -5°C and +50°C, relative humidity can be as high as 90% and shock and vibration conditions range from transportation profiles to Zone 4 earthquake environments. The Tin-Lead (SnPb) version of this product has been operating reliably in the field under these conditions for more than 20 years and the objective was to convert a limited quantity of Product A to Pb-free for internal development.The primary goal was ensure the Pb-Free version of the product had reliability metrics equal to or better than the SnPb version and the secondary goal was to do this in a cost and time effective manner. A key benefit of doing this work is that Customer A can offer an environmentally friendly product free of the six hazardous substances restricted in the RoHS Directive.Moreover, SnPb components are getting more difficult to purchase.This paper provides an overview of the process used and lessons learned.Topics covered will include industry studies, Bill of Materials review, components with limited temperature ratings, key Design for Manufacturing improvements, selection of a high reliability solder paste and wave solder flux to drastically reduce the risk of dendrite growth, product analysis by a leading university consortium, reflow profile development, cardboard and pH paper test to ensure proper wave solder spray fluxing, 45° X-Ray inspection to validate through hole solder fill, forced rework of BGA’s and through hole components, cross sections, dye and pry tests, thermal cycling, vibration testing, mechanical shock testing.The work involved multiple manufacturing and design locations within the Electronic Manufacturing Supplier (EMS) and the key steps required to ensure good communication and teamwork will be discussed.