2019 Exhibitor List

3G Shielding

ACDI

Aerotek

​Alan Lupton Associates

​Altium

American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

CertifiGroup

Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group

​EIT

​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

​ERNI Electronics

​Fineline-USA

Firan Technology Group = FTG

GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices

IES

Imaginering Inc

​Imperative Product Operations

​Indium Corporation

​IPC

Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

METZ Connect USA

MV Circuit Technology

​Nelson-Miller

Oak Mitsui Technologies

Oasis Scientific

PalPilot

​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions

​Porticos

Porticos Asia Limited

Printed Circuit Design & Fab

​ProtoLabs

ProTronics

Prototron Circuits

​RBB

​Rep Inc

Risho

Rogers Corporation

​Samtec

SEP Co LTD

Sunshine Global Circuits

Tektronix

​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc

TriMech

​TTM - Advantage Board Reps

​TUV SUD

​Wakefield-Vette

​Wallace Electronic Sales

​Wireless Research Center

​​

NOVEMBER 13th,  Raleigh, NC

Tel:  (919) 342-0810

KEYNOTE: TBD

1) IOT Hardware Project Planning - Sean Priddy, Creation Technologies


2) PCB Antenna Considerations from Concept to Certification - Mike Barts & Shruthi Soora, NC Wireless Research Center


3) EMC, Inductors, and Filtering - Doug Toth, Wurth Electronics


4) GPGPU Computing, Bringing AI to the Edge - Bob Buchanan, WDL Systems


5) EMS 4.0 - Will Webb, Astor Technologies


6) Advanced Board Manufacturing Techniques - Paul Cooke, FTG Corp


7) Applications for Embedded NiP Thin Film Resistors in Printed Circuit Boards - Bruce Mahler, Ohmega


8) Reliability Testing of Faradflex Buried Capacitance at High Voltage and Temperature - Bob Carter, Oak-Mitsui, FaradFlex Division


9) How to use GaN FETs with Standard Power Supply Controller - Brian Miller & Andrea Mirenda - Efficient Power Conversion


10) Additive Manufacturing and 3D Printing of Metal for Electronics Cooling Applications - Chris Caylor, Wakefield-Vette


11) Metal 3D Printing: Process Validation for High-Requirement Applications - Protolabs


12) Power Supply Efficiency Present and Future: Global Trends in Legislation and Energy Saving Design - Dylan Howes, Power Partners


13) BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive - Dale Lee, Plexus

14) Heitec Packageing Solutions, High Speed Backplane Technologies - Adam Butler, Wakefield-Vette

15 Creepage & Clearance Measurements - Bill Bisenius, CertifiGroup


16) High Performance Power Packaging with Highly Thermally Conductive Laminates​

- Doug Hopkins, NC State University
- Pratish Patel, EI Connect
- Kenji Nishiguchi, Risho

2019 TECHNICAL Presentations