2019 Exhibitor List

3G Shielding



​Alan Lupton Associates


American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers


Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group


​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA


​EMA Design Automation

​ERNI Electronics


Firan Technology Group = FTG

Gardner & Meredith

​GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices


Imaginering Inc

​Imperative Product Operations

​Indium Corporation


Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

Mentor, A Siemens Business

METZ Connect USA

MV Circuit Technology


Oak Mitsui Technologies

Oasis Scientific


​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions


Porticos Asia Limited

Printed Circuit Design & Fab



Prototron Circuits


​Rep Inc


Rogers Corporation



Sunshine Global Circuits


​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc


​TTM - Advantage Board Reps


​Wallace Electronic Sales

​Wireless Research Center


NOVEMBER 13th,  Raleigh, NC

Tel:  (919) 342-0810

PCB Carolina 2018 was held on November 7, 2018

KEYNOTE: Almost No One Uses the Right PC Board Stack-Up - Rick Hartley, RHartley Enterprises
Abstract:  Of all the items we control in a PC board design, that which matters most is Stack-up.  Yes, placement, routing and other features are critical, but if board stack is compromised, all other features, by definition, are compromised.  Proper board stack must lead the way.
In this keynote we will discuss why those statements are true, as well as how to craft an ideal board stack-up, be it 2 layers, 4 layers, 6 layers or 60 layers.  We will also discuss why some of the most commonly used 4 and 6 layer board stack-ups are a disastrously bad idea and why they cause interference.  More importantly, how to fix them!

4A) The X-Factor - How X-ray Technology is Improving the Electronics Assembly Process - Bill Cardoso, Creative Electron
Abstract:  It was 1895 when Wilhelm Roentgen discovered a mysterious light that allowed him to see through things – and called it x-rays. Since then, x-rays have been adopted in a wide range of applications in the electronics assembly process. Instead of taking a “deep-dive” in one aspect of x-ray inspection, in this presentation we’ll cover a broad range of applications: 
- Electronic component inspection and failure analysis.
- Component counting and material management.
- Reverse engineering.
- Counterfeit detection.
- Real-time defect verification.
- Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection.
- Design for manufacturing (DFM) and design for x-ray inspection (DFXI).
- Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). 
We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are now reality by combining AI and x-ray inspection. Moreover, we will show you a series of real-life cases on how our team of AI scientists is using AI to solve the most challenging applications in x-ray inspection. And beyond x-ray inspection, we’ll examine how AI is forever changing the way we manufacture and inspect things.

6A) Differentiating Your Design with New Performance Levels using GaN Power Solutions -  Andrea Mirenda & Brian Miller, Efficient Power Conversion Corp. (EPC)
Abstract:  State-of-the-art solutions, such as GaN power FETs and ICs, enable engineers to enhance their competitive advantage.  In this session, see what Gallium Nitride (GaN) power solutions offer in terms of size, speed, efficiency and power density.  Board layout examples show how to take advantage of EPC’s 15-350 V GaN FETs’ low parasitics.  Explore how GaN power semiconductors are smaller and more efficient than silicon solutions, and see practical examples of applications such as: power supplies, Class D audio amplifiers, LiDAR, resonant Wireless Power transfer and motor control.  A vast palette of opportunity for your next design!

4D) A Deep Dive into Metal 3D Printing - Joshua Parker, Proto labs
Abstract:  Direct metal laser sintering (DMLS) is an emerging additive manufacturing technology that has great potential to change the way metal parts are manufactured.  DMLS is ideal when trying to achieve complex geometries, lightweight metal parts, or reduced components. This presentation compares flawed versus optimized geometry, discusses part design considerations, and explores secondary operation options to keep in mind when designing for DMLS.

3C) Electromagnetic Band Gap Structure for Common Mode Filtering of High Speed Differential Signals - Dr. Bruce Archambeault
​Abstract: High Speed differential signals have become common place in the computer industry.  While the use of differential signaling can significantly improve the signal integrity, it does not eliminate EMC concerns.  Small amounts of rise/fall time mismatch, in-pair skew, or amplitude mismatch can create significant amounts of common mode signals, which, in turn, cause EMI emissions.  Discrete common mode filters are not commonly used due to their impact on the intentional signal as well as their cost.  Electromagnetic band gap (EBG) structures can filter unwanted common mode energy without reducing the signal integrity of the intentional signal.  This presentation will discuss how to design EBG common mode filters and show their use by simulations and measurements.

3A) To Ground or Not To Ground (My PCB to Chassis) - Sam Conner, IBM
Abstract:  The merits of single-point versus multi-point grounding of PCBs to the system chassis have been debated for as long as we have been making PCBs. A lot of the evidence provided is anecdotal, and many designers have latched onto one of the design philosophies like a religious belief. In this presentation, we will look at measurement and simulation data and attempt to understand the impacts to EMI, ESD, and SI for today's high-speed, high-density electronic systems. A clear winner might emerge from the data, but will anyone believe it?

6B/C) High Speed Channel Characterization (Part 1 & 2) - Jay Dipenbrock, SIRF Consultants LLC
Abstract: This presentation will describe some of the key performance parameters associated with high speed serial channels.  These include time domain impedance, eye opening, and jitter, and frequency domain S-parameters.  A sample channel will be then measured in both the time and frequency domains, displaying the measured data.  The channel’s measured data will be examined in light of some of the relevant standards.  Evidence of channel impairments in the observed, measured data will be pointed out, with possible explanations of potential means of improvement. Actual lab equipment will be used in these presentations.
​6D) Switch Mode Power Supply Layout - Rick Hartley, RHartley Enterprises
Abstract: All Switch Mode Power Supplies have 4 to 5 circuit loops, all of which are important, but a couple are downright critical, in terms of PCB layout.  An improper PCB layout of a Switch Mode Supply will sometimes not function and will often have EMI issues.  In contrast, understanding what makes up a switcher circuit and knowing how to take care of the loops, during PC Board layout, will allow these supplies to operate flawlessly, with very high efficiency and will avoid EMI problems.  This short course will outline the different types of Switcher circuits (Buck, Boost, etc.), basic theory of operation, the impact of the various components, definition and behavior of the 5 loops, layout to isolate loops, layout to minimize noise & EMI and proper grounding technique.

4B/C) Designing Reliability In, at the Designer Level (Part 1 & 2) - Gary Ferrari, FTG Circuits
​Abstract:  Today’s designers face significant challenges in their designs. They are faced with circuits consisting of low and high circuit densities, digital and  analog circuits, high speed, and micro wave circuits, to name a few. To complicate our efforts, we have rigid, flexible, and rigid/flex circuit boards. These technologies share a common goal; cost, performance, and reliability over time.
These everyday challenges make  it easy for one to overlook the importance of reliability. Let’s face it; reliability has to be designed into a product, not inspected into it. 
This session will explore several factors that affect the reliability of a product. Lastly, we will look at new and innovative ways to test and verify a product’s integrity in both leaded and lead free products. 
What you will learn
- A clear understanding of overall DFM issues that affect product Reliability
- How to apply learned principles to your designs
- Lead free DFM/DFR considerations

3D) The Basics of PCB Fabrication (101) - Paul Cooke, Firan Technology Group (FTG)
Abstract:  With ever decreasing geometries and increased density, todays printed circuit boards (PCB’s) are extremely complex. Fabricators are continually under pressure to keep up with the capabilities needed to produce these types of products.  This seminar looks at how a PCB is fabricated and the challenges the fabricator faces to achieve the design intent and meet the customer and industry standards. We will examine the processes needed to form microvia’s,  image micro bga’s, plate copper in holes the thickness of a human hair and select surface finishes needed for very tight pitch components. The half day seminar will be interactive with the audience to ensure any and all questions related to more in depth PCB fabrication and processes are answered.

5A) Easing The Path to Mass Production - William Bouverie, Mentor
Abstract: Taking a design from a functional prototype to mass production requires significant attention to detail and time.  There are non-trivial electromagnetic and safety requirements to adhere to.  Yield and manufacturability are critical for product margins.  Device reliability is critical when it comes to your customers’ perceptions of your products and your company.  Time to market for your product is crucial, and there are seemingly endless pitfalls along the way to mass production.

Explore novel CAD technologies to help streamline the process of designing hardware that is ready for mass production.  Schematic Analysis, a new class of CAD products, can be used to eliminate hard to find bugs that would otherwise go unnoticed until the system is built.  Signal and Power Integrity analyses guarantee functionality and save debug time in the lab.  Automated checking and enforcement of EMI best practices saves time in EMC certification by eliminating common mistakes in PCB designs.  Automated checking of your PCB designs against common safety standards finds issues before systems are sent off for certification, eliminating a potentially long cycle of identifying/fixing issues.  Virtualized HALT testing helps you find and eliminate vibration issues before building hardware and going through a lengthy test cycle.  DFM analysis eliminates DFM issues during the design process. Together, these technologies help customers get to production quickly and confidently.

5C) Process Driven DFM - Kevin Webb, Mentor
​Abstract:  Although DFM has been around for many years, PCB technology and the manufacturing processes have become more complex and varied, making it difficult to create a simple set of DFM rules. DFM applications today must be able to make intelligent decisions for the user about what DFM checks are relevant for their PCB materials and technology, all while considering the manufacturing processes to be used in the production. Those applications achieving this objective will serve their users better and make the benefits of Design for Manufacturing (DFM) attainable by a larger audience.

5B) A New Design to Manufacturing Ecosystem - Ed Acheson, Cadence
Abstract:  Creating a design that moves efficiently through manufacturing is high on every designers list. To accomplish this, having the right rules in the right place is key. Obtaining the rules to put in place is typically a manual process done by sending a spreadsheet with list of desired technologies to a fabricator to provide the right rule guide (usually a PDF). Designers receive this PDF and now have to map manufacturers rules to their ECAD tools rules.  Risk for misinterpretation and transposition errors is high. Designers make the mistake, they have to pay for it through additional iterations with the manufacturing partner at the tail end of the design process. 
This paper will talk about a new design to manufacturing ecosystem that eliminates the unnecessary iterations between the designer and manufacturing partners AND enables creation of a design that is right for the targeted manufacturing rules.

5D) Industry 4.0 and IPC-2581 - Ed Acheson, Cadence
Abstract:  We have all heard about Industry 4.0 – the digital, smart factory of the future. How does Industry 4.0 affect what you are doing? Will it help the design process? Industry 3.0 was about automating manufacturing processes by deploying automatic machines. Industry 4.0, driven by customer demand, is about automating the factory floor – automation of automation. For Industry 4.0 to be successful, it needs a complete digital model of the PCB that is being built and assembled. IPC-2581 – an open, neutral, global  design data hand off to manufacturing – was designed to provide a complete digital model for the PCBs. This paper will talk about what is Industry 4.0, the business benefits, how PC-2581 enables and complements the automation of automation as well as how it will bring back manufacturing data back to improve the design process.

3B) EMI shielding for High-Frequency Applications - Mazen Shehaiber, 3G Shielding Specialties
Abstract: While board level shielding is the most common and cost effective method of mitigating RF/EMI interference it often becomes ineffective in high-frequency applications. As a result, engineers must rely on relatively expensive solutions such as machined housings which also have the disadvantages of increased weight and board footprint. As an alternative hybrid shielding offers the same performance as machined housings with a significant cost savings using the footprint of a traditional metal shield.

2018 TECHNICAL Presentations