PCB Carolina (TM) 2022

Exhibitor List

3G Shielding Specialties

6to6 Technologies
Abatek Americas
American Standard Circuits

Archer Circuits
Arrow Electronics

Assembly Technologies
Aurora Technical Sales
Better Boards

C & C Technologies


Carolina Electronic Solutions

Circuit Technologies
Device Solutions
Downstream Technologies

Electronic Design & MFG
Electronic Interconnect
Electro-Rep Associates

​Elgris Technologies

EMA Design Automation

​EMA Sales


GRT Electronics
IEEE NC Council

Indium Corporation
Ingun USA

Isola Group

JMC Tool & Machine
Keystone Compliance
Leader Tech
Lincoln Technology Solutions

mta automation
Oasis Scientific

Oak-Mitsui Technologies

Ohmega Technologies
Orbel Corporation


Performance Technical Sales
PFC Flexible Circuits Limited

PKG Research Lab, NC State

​Polar Instruments



Rep Inc

Roush Yates MFG Solutions
Royal Circuit Solutions



Sierra RF

Southern Marketing Assoc

Specialty Coating Systems

Teledyne LeCroy



Valtronic Technologies
VPI Technology Group
Wallace Electronic Sales
WDL Systems
Wireless Research Center


November 9th

(919) 342-0810

​McKimmon Center

1101 Gorman Street

Raleigh, NC 27606

KEYNOTE ADDRESS) First in Flight to Next in Flight
Basil Yap, Vice President - Hovecon, LLC

Stuart Ginn MD.,Medical Director, WakeMed Innovations; Co-Founder LEEP Mobility Systems 
Since its humble beginnings on a North Carolina beach in 1903, aviation has transformed industry and society in America and abroad.  Over the past few years, the most significant transformation in aviation technology since the jet engine has taken root, driven by a confluence of technology advancements in electrification, software, and networked systems.  Drones and “air taxis” are already flying in our state, and concepts once confined to the realm of science fiction are becoming a reality.  Learn more from two innovators about what to expect from this new era of flight.


3A) The 6 Hazards of Product Safety
William Bisenius, President and co-founder, CertifiGroup

Abstract: We all use electrical products as a daily part of our personal and working lives without realizing the potential hazards these products present. Even now, with frequent news stories telling us of people who were injured by their e-cigarette or cell phone, we assume that the products we use will be fine. In the United States, electrical products bear the “UL” mark to indicate that they comply with the applicable UL standard and are therefore safe for use. There are over 600 UL safety standards for various types of electrical products. All electrical product manufacturers in the US need to build their products to comply with these standards. All manufacturers in the US need to choose safe products for their employees to use. Yet there is no university in the world that teaches product safety. This presentation will teach you the “6 Hazards of Product Safety”. Product compliance standards and governing requirements can be difficult to read, understand, and more importantly apply without knowing the intent of the requirements. This presentation will greatly help ALL safety professionals from beginner to advanced. By understanding the “6 Hazards of Product Safety”, you will better understand the hazards presented by electrical products, thereby allowing you to make better personal and work decisions related to the development, implementation, and use of electrical products. Whether your company makes a product or just uses electrical products, this knowledge will benefit you for the rest of your life. ​

3B) A “Chicken or Egg” Approach to Electromechanical Product Design

Sam Felts, Head of Product Development - Touchstone 3D
Sarah Hall, Mechanical Engineer - Touchstone 3D

Abstract: Which came first, the chicken or the egg? How do industrial design, mechanical engineering, and electronics engineering influence each other? Should you design the product first, and hope the electronics fit? Or should you engineer the electronics, and then try to wrap a product around it?
Join us to discuss how to successfully integrate these disciplines into a product that consumers want and avoid costly design iterations. 

3C) Making Intelligent Material Decisions
Michael R. Creeden, Technical Director Design Education - Insulectro
Abstract: In meeting today’s dense, high-speed circuits that have competing requirements. With this presentation, attendees will learn solutions to help avoid the most common failure points in today’s Printed Circuit Engineering Layouts. Attendees will walk away with real world applications for success, they will receive an understanding of how to implement pro-active solutions rather than re-active responses. Meeting these competing perspectives without compromising any one of them must be considered because they all play a part in the design, manufacturing, and performance of our end products. Failure can come in the following forms. 
- Physical, electrical, environmental perspectives of our materials
- Technically appropriate material selection 
- Technical performance, (SI) signal integrity/EMC applications
- High manufacturing reliability and producibility and yield
The focus will be on practical application and implementation using real world examples

3D) Place and Route for Dense High-Speed and RF Circuits
Michael R. Creeden, Technical Director Design Education - Insulectro
Abstract: With this presentation the attendee(s) will receive a solid overview of Place and Route for Dense High-Speed and RF Circuits. We will cover a wide range of topics including, next generation materials, the rational for considering HDI for our products and overall layout flow. We will discuss the technological challenges we face in both the schematic circuit rules capture, design layout and manufacturing process. Students will learn what it takes to satisfy solvability, high-speed concerns, and RF performance issues, while still building a board that will be cost effective as a reliable high yield product. We will also review how our early integration with the manufacturing team during the design cycle will help us understand the specifics to build a product that is correct-by-construction and performs on revision-1.
The focus will be on practical application and implementation using real world examples


4A) Flexible Circuits when/where to use, bending and forming, cost drivers and more…
Mark Finstad, Director of Application Engineering - Flexible Circuit Technologies
Abstract: Trends including IoT, connectivity, miniaturization, wearables, challenging form factors, mobility, and simply packing more electronic capabilities into smaller spaces are driving product development engineers to more specialized interconnects.   This presentation covers at a high level when/where to use flex/rigid flex/specialty interconnects.  It also will cover Bending and Forming of Flexible Circuits and further, a review of Cost Drivers.  Attendees can also ask specific detailed questions that they may have; involving mechanical layout, mechanical/electric conflicts and more. ​

4B) Semi-Additive Processing: Make the Most of New Technology
Tara Dunn, VP of Marketing and Business Development -  Averatek Corporation
Abstract: Semi-Additive Processing (SAP) for PCB fabrication is getting a lot of attention these days.  This presentation provides a broad overview of the technology that will serve as a solid foundation for you to stay up to date as new developments are introduced in this fast-paced arena.  
We will discuss the benefits of SAP, review the process as compared to traditional subtractive etch processes, review information about materials and provide real-world case studies. 

4C) Advanced Processes to Meet Today’s Design Challenges
Paul Cooke - Field Application and Technical Sales Manager, AGC - Taconic Materials
Abstract: Designing printed circuit boards (PCB) and assemblies is more difficult than ever due to complexity, component availability, thermal requirements, signal integrity, material selection, layer counts, harsh environments and increased functionality all required in smaller form factors. We will look at all the elements to successfully manufacture a PCB that can meet all the designers’ requirements and perform to the customer and industry standards as well as survive in today’s harsh environments. We will look at some of the more advanced process’ and materials being adopted by the fabricators to produce smaller, thinner more reliable and faster production times to meet quick turn requirements. We will look at various processes and materials including plating shut, interposer designs, high reliability, high layer 5+ stacked microvia designs with 3 mil microvias, heavy copper solutions, and new hole fill processes without the need to planarize. All these processes need to ensure the product is robust as possible with a high level of confidence that it has been designed for extended life in the field.

PCB Resonance, Near Field and Far Field Noise, using Ultra-Thin Dielectrics and Embedded capacitance
Bob Carter, VP of Marketing, Business Development, and Technology - Oak-Mitsui
Abstract: For high speed printed circuit board designs embedded capacitance is often used.  This presentation will examine the impact of emerging ultra-thin film PCB laminates technology for PDN decoupling on PDN architecture and its impact on noise.  We will look at variables in different applications and consider reduction strategies. We will also examine considerations, such as manufacturability, cost, and reliability.

5A) Choosing the Right Conformal Coatings for Harsh PCBA Operating Environments
Robert (Dusty) Askin, Senior Director of Process Engineering - HZO

Abstract: Protective conformal coatings provide proven, reliable protection for PCBAs exposed to corrosive chemicals, moisture, gases, salt spray, pollutants and more which otherwise could compromise component functionality. Every conformal coating is different and offer varying levels of protection, ease of application, cost, environmental considerations, and more.  
When choosing a conformal coating for your next project, it’s critical to be aware of the attributes of each conformal coating and select the best one for your project. This technical presentation will provide assistance with selecting the right material and process for your desired application.  ​

5B) Engineering Reliability with Epoxy and Urethanes
Brian Hanson, Vice President of Sales - EFI Polymers Inc.
Abstract: As automotive, battery, and electronics technology continues to develop, the need to push more power and capability through electronics grows. As we continue to rely more and more on electronics, the need to protect those electronics from heat, water, dirt, dust, vibration and other contaminants also grows. Epoxies and urethanes have been used to protect electronics for over 50 years. However, many companies view potting and the potting process as difficult, expensive, and prone to quality issues. This white paper seeks to provide an overview of potting materials, and how to better incorporate them into your manufacturing process including how potting materials help with thermal management, how physical properties impact the finished parts, and the importance of designing with processing in mind. 

5C) Solid Liquid Hybrid TIMs
Miloš Lazić,  Product Development Specialist (TIMs), Certified SMT Process Engineer) - Indium
Abstract: For many years, metals have been used as thermal interface materials (TIMs) in the industry. With high-reliability and high thermal conductivity, metals have been a great solution, especially for challenging applications. Thermal properties of any TIM are defined by their thermal conductivity and interface resistance. The biggest obstacle for metal TIMs to overcome is interface resistance. Because most metals are very stiff, a certain amount of pressure needs to be applied to form a close connection between the materials, thus lowering interface resistance. As electronic devices are continually getting smaller, consuming more power, and producing more heat, finding the right TIM becomes one of the top priorities in any application. Solid liquid hybrids (SLHs) are the next generation of metal TIMs. SLHs are a combination of metals that are solidus at room temperature with ones that are liquidus at room temperature. With low thermal resistance and low bondline thickness, SLHs are the perfect solution for certain high-end applications. This paper will discuss the possible applications where SLHs can be used, as well as challenges and obstacles that still need to be overcome to encourage adoption across the industry.  ​

5D) Specifying Oscillators: Crystal Oscillator Types and Cost Effective Performance
Kory Stone, Sr Director, Technical Sales & Marketing - Taitien, USA
Abstract: There are many types of Crystal oscillators and many things that drive the performance the oscillator. The purpose of this presentation is to review the range of performance available with different types of crystal oscillators and how to specify them properly. This presentation will review the issues that influence oscillator stability and noise. We will look at the different types of crystal oscillators and the ways that the instabilities are controlled. We also review how to specify the oscillator requirements for cost effective implementation

6A) PCB Weave mitigation/fundamentals in PCB and PCB Skew Measurement and system BER skew effects with Keysight equipment
Steve Scearce - Principal Engineer/Engineering Manager of Cisco’s Electronics Packaging and Diagnostics team - Cisco
​Abstract: The glass weave effect on current and next generation PAM-4 systems have shown bit error rate issues in the Lab. Our lab results show that our PAM-4 systems are more sensitive for PN skew than previous generations of NRZ with the same UI. For the current generation of designs we must consider glass direction, glass type, weave pitch, art work rotation, and weave density.  Future Stackup decisions are based on the on the measured network parameters, TDR, silicon BER, and system eye diagram measurement results. Techniques used to mitigate the unbalance effect of the glass weave with differential pairs are discussed here and statistical measurement results will be shared.  In addition we are partnering with Keysight to facilitate lab skew measurements and actual BER degradation effects on signal error rates due to the system skew effects.

6B and 6C) Component and Wiring Considerations for PCB Designers (Parts 1 and 2)
Dr. Bruce Archambeault, Retired and Jay Diepenbrock, SIRF Consultants
 This presentation will discuss several principles that are important for PCB designers for good Signal Integrity, Power Integrity, and Electromagnetic Compatibility (EMC).  A brief review of the theory behind each principle will be presented, followed by a practical demonstration using a PC board and test equipment.  The principles to be discussed include:
• Self-inductance and the effect of wire conductor size and distance from the return path (loop area);
• Lenz’ Law, which is physically the same as self-inductance but in this case applies to PCB traces over return planes;
• Crosstalk, which is undesired energy coupled to neighbor traces from a driven trace.  The phenomena of critical frequency, resonance, and influence of termination and return plane gaps will be demonstrated;
• Inductance of Capacitors, which is influenced by the length of connecting traces, capacitor packaging and dielectric material, and even the value of the capacitor itself;
• Electrical effects of traces routed over return plane gaps (splits).
Some of these may be things you never thought you had to worry about, and the results may surprise you.

6D) Design and Manufacturing Developments to Lower Insertion Loss and Digital Pair SKEW
Norm Berry, Director Laminates and OEM Marketing - Insulectro
Abstract: As frequency increases, differential pair SKEW and insertion loss become critical considerations for PCB design.  Understanding the impact of the base laminate composite is necessary to assure a desired end attribute.  

2021 TECHNICAL Presentations​