Venue:

2019 Exhibitor List

3G Shielding

ACDI

Aerotek

​Alan Lupton Associates

​Altium

American Circuits

Amitron Corporartion

​Arrow Electronics

Aurora Technical Sales

​Automation Engineering Group

Better Boards​

C & C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

CertifiGroup

Circuit Technology

​Creation Technologies

​Device Solutions

DNA Group

​EIT

​Elantas PDG

​Electro-Rep Associates

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

​ERNI Electronics

​Fineline-USA

Firan Technology Group (FTG)

GOT Interface

GRT Electronics

​Hamilton PCB Design

​Hughes Peters

I-Tech eServices

​ICAPE Group

IES

Imagineering Inc

​Imperative Product Operations

​Indium Corporation

​IPC

Isola Group

​JBC Tools USA

Keysight Technologies

​Laut Design

Lincoln Technology Solutions

METZ Connect USA

​Nelson-Miller

Oak Mitsui Technologies

Oasis Scientific

PalPilot

​Performance Technical Sales

PFC Flexible Circuit

​PICA Manufacturing Solutions

​Porticos

Porticos Asia Limited

Printed Circuit Design & Fab

​ProtoLabs

Prototron Circuits

​ProTronics

​RBB

​Rep Inc

Risho

Rogers Corporation

​Samtec

SEP Co LTD

Sunshine Global Circuits

Tektronix

​Teledyne LeCroy

The Test Connection - TTCI

​TFS Inc

TriMech

​TTM - Advantage Board Reps

​TUV SUD

​Wakefield-Vette

​Wallace Electronic Sales

​WDL Systems

​Wireless Research Center

​​

NOVEMBER 13th

(919) 342-0810


​McKimmon Center

1101 Gorman Street

Raleigh, NC 27606

KEYNOTE: Internet of Things (IoT), An Overview with IoT Application from Bayer Crop Science

Tom Snyder, R!ot Labs

Abstract: We are in the midst of just the 4th Industrial Revolution in history. Connected devices and the big data intelligence they enable fundamentally changes every industry, in much the same way that information technology, electricity and mechanized production - the other 3 Industrial Revolutions - each changed the world. This talk overviews converging technologies that are driving transformation, sifts the signal from the noise of IoT hype and offers suggestions on how to engage in the Data Economy. 


Gaelle Fages, Bayer Crop Science

Abstract: What happens when IoT meets a rodent trap ? You get a rodent trap that can be monitored 24X7 from anywhere in the world, increasing farm to fork transparency and protecting our food supply from dangerous, rodent borne pathogens. 
Gaëlle Fages shares how Bayer is leveraging IoT to achieve its mission “Science for a Better life”, exemplifying the new direction and transformation undertaken by a 155-year-old company best known for selling chemicals and pharmaceuticals.


3A) IoT Hardware Project Planning
Sean Priddy, Creation Technologies
Abstract: A Cisco survey revealed that almost ¾’s of all IoT projects fail. With most IoT attention focused on software, services, and analytics often the hardware risks are neglected. Learn from our experience how to identify and mitigate common risks to help you create a successful IoT hardware project plan.


3B) EMC, Inductors, and Filtering
Doug Toth, Wurth Electronics
Abstract: Why am I having issues with EMC? When it comes to EMI there are a variety of factors that can affect the performance of your system. These factors can range from component selection to PCB trace location. During this presentation we will discuss the basics of EMC, what causes EMI and understanding how to filter out your unwanted noise. 

3C) GPGPU Computing, Bringing AI to the Edge
Rob Callaghan, P. Eng, Connect Tech
Abstract: • As the largest NVIDIA® Eco-System Partner for the Jetson™ AGX Xavier™,  TX2/TX2i/TX1 and Jetson Nano, Connect Tech is involved in a wide range of exciting embedded applications. This presentation will discuss why the NVIDIA Jetson is so well targeted for applications in robotics, autonomous machines and intelligent video analytics. See the vast number of Deep Learning and AI applications taken to market through joint Connect Tech & NVIDIA Jetson solutions. From the International Space Station to the deepest depths of the ocean, NVIDIA Jetson and Connect Tech have gone there (together). The NVIDIA AGX Xavier boasts a 20 times performance boost over the Jetson TX2, while the Jetson Nano is providing supercomputing in a $99 development kit package. Connect Tech will provide comparisons between the recently released Jetson Nano to the Xavier and the Jetson TX2; highlighting differences that will help Jetson Users or potential Jetson Users determine which platform will be the ideal fit for their application.


3D) Industry 4.0 and Manufacturing Test Coverage
​Will Webb, Astor Technologies
​Abstract: 
In order to deliver Defect Free Products, ASTER is promoting a new vision of Design to Delivery flows, by applying the principles of Industry 4.0 principles. It is named Enhanced Manufacturing Services 4.0 (EMS 4.0).  EMS 4.0 can be used as part of an organization’s Continuous Improvement Program, to decrease product development time, production cost and manufacturing cycle-time, while increasing product quality, reliability and ultimately the customer satisfaction.
EMS 4.0 is articulated on two principles: 
1) Qualify the customer defect universe using traceability and repair loops (big data analysis). This universe includes not only manufacturing defects, but also design, and functional defects.
2) Simulate the manufacturing flow from schematic or layout file in order to identify the possible consequences of inadequate testability and test coverage on a new design.
Traditionally, manufacturing and test constraints are only considered at the end of the layout phase, just prior to the transfer of CAD data to production. This is too late to have a significant contribution on time to market.  With EMS 4.0, TestWay significantly decreases the overall cycle time from the design concept to customer delivery, which is a critical success factor. It makes it possible to implement a Lean Test approach that produces a lower cost product whilst maintaining the highest quality.
Using Digital Simulation, TestWay creates a virtual copy of the physical world. It allows “What-if” scenarios played in the virtual word to identify the optimal physical flow, using theoretical results to control the physical world.  The EMS 4.0 workflow enables tremendous benefits in time-to-market, cost reduction and quality improvements.


4A) High Performance Power Packaging with Highly Thermally Conductive Laminates​
Doug Hopkins, NC State University
Abstract: 
The trend to higher performance power electronic systems has fostered more electrophysical integration of microelectronics packaging and assembly approaches. This presentation reviews the new trends in Heterogeneous Integration. A focus on power packaging using thin organic substrates, specifically Epoxy Resin Composite Dielectric (ERCD) materials with thermal conductivities up to 10W/mK is given. The thin dielectrics in the 80-120µm range outperform traditional alumina DBC, allow for embedding of components and layering of power ground planes while maintaining high voltage breakdown voltages (up to 5kV/mm). The thinness of the material may require some special handling equipment depending on feature sizes, such as direct laser imaging for circuits and solder mask. However, for power more conventional fabrication processes, such as copper etching and plating may be sufficient.
     This presentation covers material characteristics and new prototyping capabilities at NC State University’s PREES power packaging laboratory. An example design of a power-GaN based integrated power module (IPM) is provided from electrical circuitry, through processing steps to fabrication. The example is concluded with a completed open-source IPM design with electrical test results.


4B) High-speed system architectures - A comparison and application examples
Hendrik Thiel, Heitec AG
Abstract: 
The presentation will provide an overview of the currently leading high speed serial architectures including VPX, CompactPCI Serial and xTCA. 
It will cover the evolution of standards from parallel to serial bus, the market acceptance in various market segments, the availability of off-the-shelf boards and systems. 
A technical comparison of the technical features will complete the technical part.
Application examples will show real world examples of the compared high-speed backplane architectures as well as proprietary solutions.


4C) Applications for Embedded NiP Thin Film Resistors in Printed Circuit Boards

Bruce Mahler, Ohmega
Abstract: There has been a growing use of the NiP thin film resistive material as embedded heaters on inner layers of  multilayer printed circuit boards.  This paper will review the methodology and results of characterizing heat rise vs. power input for resistors of various sizes and sheet resistivities (values).  From this characterization process, general design rules can be established for temperature rise vs. power input for specific heater requirements.
This paper will also review a number of heater designs and applications including a patent pending design method for increasing or decreasing the resistor values of heater elements to the nominal values required within constrained circuit areas for the power input and temperature rise of a given application. 


4D) Reliability Testing of Faradflex Embedded Capacitance at High Voltage and Temperature

Bob Carter, Oak-Mitsui, FaradFlex Division

Abstract: For high speed printed circuit board designs embedded capacitance is often used.  The embedded capacitance materials for printed circuit boards are typically qualified by assessments of assembly survivability and by relatively short term conductive anodic filament testing at 100V or less, 65-85˚C, 85% relative humidity testing for 500 to 1000 hours depending on the application. The tests set a baseline for reliability for typical, lower voltage applications that has served the industry well. To understand the long-term reliability of the embedded capacitance materials, acceleration factors for temperature and voltage need to be developed. Testing at high voltages, 800V, 650V, and 500V, plus high temperatures of 150˚ and 125˚C has been running for over 3.5 years to evaluate the embedded capacitance reliability. As a comparison, 100V rated ceramic capacitors were also evaluated in this testing. The paper reports the results for the 150˚C testing.  


5A) Additive Manufacturing and 3D Printing of Metal for Electronics Cooling Applications

Chris Caylor, Wakefield-Vette

Abstract: Additive manufacturing, especially for metals, is growing quickly to become a mature tool for engineers to use to achieve thermal designs that either exceed performance or can be manufactured faster and less expensively than traditional methods.  Wakefield-Vette will present on overview of metal additive manufacturing methods and some criteria to use to find the specific projects where additive manufacturing can bring value.  ​

5B) Metal 3D Printing: Process Validation for High-Requirement Applications

George Morar, Protolabs

Abstract: Many companies are new to additive manufacturing and want to take advantage of the benefits provided by metal 3D printing (lightweighting, component reduction, internal channels) in end-use applications. Oftentimes these applications have high-requirements and call for process validation, material traceability, inspection reporting, tracing heat treat cycles, specific quality certifications, and several other post-build processes. 

This presentation will help attendees understand how parts are built using direct metal laser sintering, how to design for the process, and the additional resources required for process validation, material traceability, and quality inspections. Whether the attendee is new to additive manufacturing or evaluating metal 3D printing technology for their production project, this presentation will help identify when the technology provides the most value and what to consider when used to manufacture high-requirement parts. 

Attendees will learn:
• What industries and applications can benefit most from metal 3D printing  • How to design for the metal 3D printing process
• What to consider when evaluating metal 3D printing for a production project



5C) How to use GaN FETs with Standard Power Supply Controller
Brian Miller & Andrea Mirenda - Efficient Power Conversion
Abstract: 
GaN power transistors are smaller and more efficient than silicon MOSFETs in switching power applications such as power supplies, LED lighting, and other applications.  Can engineers design products with EPC’s GaN FETs using existing controllers for silicon MOSFETs?  In many cases, the answer is “yes”.  Join this talk to see an overview of how you can use GaN FETs with many existing power controllers.  To develop products that are smaller, more efficient, and cost competitive.  ​


5D) Power Supply Efficiency Present and Future: Global Trends in Legislation and Energy Saving Design

Dylan Howes, Power Partners

Abstract: The discussion will detail current and upcoming laws and regulations surrounding power supply efficiency as well as provide a technical overview of power supply loss mechanisms and the current and emerging topologies and technologies for mitigating those losses. There will also be some discussion on the tradeoffs associated with these energy saving techniques and potential adverse impacts of efficient power supply design.


6A) BGA’s, LGA’s, QFN/DFN’s – Oh My, Can Traditional DFM Survive
Dale Lee, Plexus
Abstract: Today’s electronic product designs are rapidly increasing the use of bottom terminated components (BTC’s), whether they are collapsible/non-collapsible ball grid array (BGA), solder bump grid array (BGA?), land grid array (LGA), quad-flatpack no-lead (QFN) or dual-flatpack no-lead (DFN) component packaging technologies.  However, with some BTC package designs vary greatly in solder pad design and pitch within the same package.  This variability impacts the ability to incorporate good DFM practices and selection of applicable assembly workmanship rules for these and other standard BTC component package designs. This presentation will highlight impact elements these component technologies have on the assembly, cleaning and inspection processes and what actions can be made during the DFM and NPI process to minimize yield impacts on the manufacturing process. 

6B) Advanced Board Manufacturing Techniques
Paul Cooke, FTG Corp
Abstract: 
Designing printed circuit boards (PCB's) and assemblies is more difficult than ever due to complexity, component availability, thermal requirements, signal integrity, material selection, layer counts, harsh environments and increased functionality, all required in smaller form factors. We will look at all the elements to successfully design a more complex PCB. We will then look at the  advanced fabrication techniques to manufacture that design and meet all the designers’ requirements and perform to the customer and industry standards. We will look at everything from materials to surface finishes and testing and explore the most intricate of these factors and how the interrelationship of up- and downstream processes contribute to making a repeatable manufacturing process. We will look at all the new fabrication techniques available to the PCB fabrication manufacturers and what new processes are available

Participants should have some knowledge of the PCB fabrication process. In addition, new topics will be presented. 
The course is condensed into 45 minutes and would appeal to process engineers, engineering managers, those involved in printed circuit assembly, circuit board designers and those involved in purchasing circuit boards and qualifying printed board fabricators. The offering will also benefit individuals looking to gain a much broader view of PCB manufacturing.


6C) PCB Antenna Considerations from Concept to Certification

Mike Barts & Shruthi Soora, NC Wireless Research Center

Abstract: All transmitting/receiving devices need an antenna to communicate. There are many different architectures for antennas and one option is to print it on the PCB board. It is a great approach, but can have issues if not implemented correctly. Mike Barts and Shruthi Soora, senior staff engineers from the Wireless Research Center will go over the points to consider when designing a PCB antenna throughout the product design cycle from concept to certification. 


6D) Creepage & Clearance Measurements
Bill Bisenius, CertifiGroup
Abstract: This presentation will teach the “how-to’s” of creepage & clearance measurements = what is creepage distance, what is clearance distance, the parameters that affect creepage & clearance the minimum creepage & clearance distance required, how to identify the creepage & clearance requirements applicable to your product and pcb’s, how to measure the creepage & clearance distances in your product/design and pcb layout, and how to fix insufficient distances on finished products and boards. The adjoining presentation will show close-up pictures of some measuring tools, related specs from the standards, and some photos of pass/fail examples.
Test equipment will be used during the demonstration and shared with the attendees - this includes a steel ruler, digital calipers, digital micrometer, creepage & clearance feeler gauges, force gauge with finger probe tip, and an optical comparator. A few example products will be "tested" during the demonstration – this includes a populated circuit board, a bare circuit board with trace pattern, and a transformer. Audience members will be given an opportunity to personally conduct sample measurements. Common causes for failure and typical methods for designing for compliance will discussed. The material presented applies to most UL, CSA, EN, & IEC standards.

2019 TECHNICAL Presentations