​​​

​3G Shielding Specialties

ACDi

Adiva Corporation

​Aerotek

Altium

American Circuits

​Antenna Test Lab

Arrow Electronics

​Aspocomp Group

Assembly Technology

​Aurora Technical Sales

Bare Board Group

Better Boards​

C&C Technologies

Cadence Design Systems

Carolina Electronic Assemblers

Circuit Technology

Compunetics

​Creation Technologies

DNA Group

​Downstream Technologies

​Elantas PDG

Electronic Interconnect

​Eltek USA

EMA

​EMA Design Automation

Emerging Power

ERNI Electronics

Fineline - USA

Firan Technology Group (FTG)​

Gardner & Meredith

General Microcircuits

GRT Electronics

​Isola Group

​I-TECH eServices

​IMDS DATA

Indium Corporation

IPC

​JBC Tools USA

​JMC Tool & Machine

Keysight Technologies

Leader Tech

Lincoln Technology Solutions

Marathon Technical Assoc

Mentor, a Siemens Business

METZ Connect USA

Nelson-Miller

​Oasis Scientific

PalPilot

​Panacol-USA

​Performance Technical Sales

PFC Flexible Circuits Limited

PICA Manufacturing Solutions

Porticos

Porticos Asia Limited

​Printed Circuit Design & Fab

​Protolabs

​Pulsonix

​Rep Inc

​Risho

Royal Circuit Solutions

​Samtec

Seltech

​SEP Co

​Tektronix

​Teledyne LeCroy

​TFS, Inc.

The Test Connection

​Touchstone 3D

​TriMech

​TTM Technologies

Wallace Electronic Sales

WDL Systems

Wurth Electronics CBT

Zentech Manufacturing


2018 Exhibitor List

Tel:  (919) 342-0810​

Presentor Company Topic ROOM Headcount
Keynote
8:30-9:15
Rick Hartley RHartley Enterprises Almost No One Uses the Right PC Board Stack-Up 2
SESSION
A

9:30
|
10:30
Sam Conner IBM To Ground or Not To Ground (My PCB to Chassis) 3
Dr. Bill Cardoso Creative Electron  The X-Factor - How X-ray Technology is Improving the Electronics Assembly Process 4
William Bouverie Mentor Easing The Path to Mass Production 5
Andrea Mirenda
Brian Miller
Efficient Power Conversion  Differentiating Your Design with New Performance Levels using GaN Power Solutions 6
SESSION
B

11:00
|
12:00
Mazen Shehaiber 3G Shielding Specialties EMI shielding for High-Frequency Applications 3
Gary Ferrari FTG Circuits Designing Reliability In, at the Designer Level
(Part 1)
4
Edward Acheson Cadence Design Systems A New Design to Manufacturing Ecosystem 5
Jay Diepenbrock  SIRF Consultants High Speed Serial Channel Measurements
(Part 1)
6
SESSION
C

2:00
|
3:00
Bruce Archambeault IEEE Fellow
Adjunct Professor
Electromagnetic Band Gap Structures on PCBs to Filter Common Mode noise on high speed diffs 3
Gary Ferrari FTG Circuits Designing Reliability In, at the Designer Level
(Part 2)
4
Zac Elliott Mentor Continuing Test Point Management Through-out a PCB Design Flow 5
Jay Diepenbrock SIRF Consultants High Speed Serial Channel Measurements
(Part 2)
6
SESSION
D

3:30
|
4:30
Paul Cooke Firan Technology Group (FTG) The Basics of PCB Fabrication (101) 3
Joshua Parker Proto Labs  A Deep Dive into Metal 3D Printing 4
Edward Acheson IPC-2581 Consortium Industry 4.0 and IPC-2581 5
Rick Hartley RHartley Enterprises Switch Mode Power Supply Layout  6
theater classroom
160 102 3
156 108 4
110 68 5
200 144 6

Technical schedule

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​Better Boards